Fume, Smoke Extraction

Image Part Number Description / PDF Quantity Rfq
0AL2102

0AL2102

EMIT

FUME ABSORBER MOBILE UNIT 230V

0

WFE8S

WFE8S

Xcelite

FUME ABSORBER MOBILE UNIT 120V

0

080506D

080506D

EMIT

FUME ABSORBER MOBILE UNIT 120V

0

021820ID

021820ID

EMIT

FUME ABSORBER MOBILE UNIT 230V

0

0LX4010D

0LX4010D

EMIT

FUME ABSORBER MOBILE UNIT 230V

0

070362

070362

EMIT

FUME ABSORBER MOBILE UNIT 230V

0

0LX2010D

0LX2010D

EMIT

FUME ABSORBER MOBILE UNIT 400V

0

0LX2100D

0LX2100D

EMIT

FUME ABSORBER MOBILE UNIT 230V

0

072116 - HOSE

072116 - HOSE

EMIT

FUME ABSORBER MOBILE UNIT 120V

0

080500D

080500D

EMIT

FUME ABSORBER MOBILE UNIT 120V

0

T0053623299N

T0053623299N

Xcelite

FUME ABSORBER MOBILE UNIT 120V

0

35445

35445

EMIT

FM EXTRCT DUO HEPA 120VAC

0

080502D

080502D

EMIT

FUME ABSORBER MOBILE UNIT 230V

0

T0053663299

T0053663299

Xcelite

FUME ABSORBER MOBILE UNIT 120V

0

130-1000-ESDN

130-1000-ESDN

Xcelite

FUME ABSORBER BENCH TOP 100-240V

0

0PV4013D

0PV4013D

EMIT

FUME ABSORBER MOBILE UNIT 120V

0

080753D

080753D

EMIT

800 VACUUM CONTROL 230V

0

WFE2XKIT1S

WFE2XKIT1S

Xcelite

FUME ABSORBER BENCH TOP 100-240V

0

35943

35943

EMIT

FUME ABSORBER BENCH TOP 220V

0

35447

35447

EMIT

FUME EXTRACTOR DUO 120VAC

0

Fume, Smoke Extraction

1. Overview

Soldering, desoldering, and rework products are essential tools for electronic assembly, repair, and manufacturing. Soldering involves joining metal components using molten filler material (solder), while desoldering removes solder to separate components. Rework processes address defects or modifications in assembled PCBs. Fume and smoke extraction systems mitigate health hazards by capturing harmful particulates and gases generated during heating processes. These technologies ensure product reliability, compliance with safety standards, and efficiency in high-precision industries.

2. Main Types & Functional Classification

TypeFunction FeaturesApplication Examples
Soldering IronsManual heating tools with temperature controlPCB assembly, prototyping
Reflow OvensInfrared/convection heating for SMT solderingMass production of smartphones
Desoldering PumpsVacuum-based solder removalComponent replacement on motherboards
Hot Air Rework StationsPrecise thermal control for BGA/QFN packagesRepairing semiconductor chips
Smoke ExtractorsMulti-stage filtration (HEPA/activated carbon)Enclosed soldering workstations

3. Structure & Components

Soldering tools typically include a heating element, temperature sensor, and ergonomic handle. Rework stations integrate programmable thermal profiles and optical alignment systems. Fume extraction units consist of: - Inlet nozzle/arm for targeted capture - Pre-filter (dust collection) - HEPA filter (0.3 m particulate removal) - Activated carbon layer (gas/odor adsorption) - Industrial-grade centrifugal fan

4. Key Technical Specifications

ParameterTypical RangeImportance
Temperature Control200-480 C 1 CPrevents thermal damage to components
Smoke Capture Efficiency 99.9% for 0.5 m+ particlesMeets OSHA/REACH standards
CFM (Airflow Rate)80-300 CFMDetermines contaminant removal speed
Filter Lifespan500-2000 operating hoursImpacts maintenance costs
Thermal Recovery Time<10 secondsMaintains process continuity

5. Application Fields

Key industries include: - Electronics manufacturing (SMT/BGA assembly) - Automotive (ECU repair, sensor calibration) - Aerospace (avionics maintenance) - Medical device production - Semiconductor packaging

Example: A smartphone PCB rework line uses hot air stations (BGA resoldering) with integrated smoke extraction achieving 99.95% particulate removal.

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Features
MetcalMX-5000 Soldering SystemSmartHeat technology, 1 C stability
HakkoFR-301 Desoldering Iron2-stage vacuum pump, 350 C in 15s
Cambridge EngineeringSeries 7000 Smoke Extractor4-stage filtration, 250 CFM
ERSAVersaflow 4/55 Selective SolderingModular design, nitrogen inerting

7. Selection Recommendations

Consider: - Process compatibility (e.g., lead-free solder requires 350 C) - Workspace constraints (arm length for extractors 80cm) - Energy efficiency (PWM-controlled heating elements) - Filter replacement costs (carbon saturation indicators) - Integration capabilities (IoT-enabled temperature logging)

8. Industry Trends

Emerging developments: - AI-powered thermal profiling for predictive soldering - Nanofiber filters achieving 99.999% efficiency - Miniaturized on-tip heating elements for 0201 component work - Centralized extraction systems with real-time particle counters - Laser-assisted selective soldering for 5G RF modules

RFQ BOM Call Skype Email
Top