| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
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EMIT |
FUME ABSORBER MOBILE UNIT 230V |
0 |
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EMIT |
FUME ABSORBER MOBILE UNIT 230V |
0 |
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EMIT |
FUME ABSORBER MOBILE UNIT 120V |
0 |
|
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Xcelite |
FUME ABSORBER MOBILE UNIT 120V |
0 |
|
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EMIT |
FUME ABSORBER MOBILE UNIT 230V |
0 |
|
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EMIT |
FUME ABSORBER MOBILE UNIT 230V |
0 |
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Xcelite |
FUME ABSORBER MOBILE UNIT 120V |
0 |
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EMIT |
FUME ABSORBER MOBILE UNIT 120V |
0 |
|
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EMIT |
FUME ABSORBER MOBILE UNIT 120V |
0 |
|
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Xcelite |
FUME ABSORBER BENCH TOP 100-240V |
0 |
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EMIT |
FUME ABSORBER MOBILE UNIT 230V |
0 |
|
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EMIT |
FUME ABSORBER MOBILE UNIT 120V |
0 |
|
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EMIT |
FUME ABSORBER MOBILE UNIT 230V |
0 |
|
 |
EMIT |
FUME ABSORBER MOBILE UNIT 120V |
0 |
|
 |
Tronex (Menda/EasyBraid/Tronex) |
FUME ABSORBER MOBILE UNIT 120V |
0 |
|
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EMIT |
FUME ABSRB MOBILE UNIT 120V/230V |
0 |
|
 |
EMIT |
FUME ABSORBER MOBILE UNIT 230V |
0 |
|
 |
EMIT |
FUME ABSORBER MOBILE UNIT 230V |
0 |
|
 |
Xcelite |
FUME ABSORBER BENCH TOP 120V |
0 |
|
 |
EMIT |
FUME ABSORBER MOBILE UNIT 230V |
0 |
|
Soldering, desoldering, and rework products are essential tools for electronic assembly, repair, and manufacturing. Soldering involves joining metal components using molten filler material (solder), while desoldering removes solder to separate components. Rework processes address defects or modifications in assembled PCBs. Fume and smoke extraction systems mitigate health hazards by capturing harmful particulates and gases generated during heating processes. These technologies ensure product reliability, compliance with safety standards, and efficiency in high-precision industries.
| Type | Function Features | Application Examples |
|---|---|---|
| Soldering Irons | Manual heating tools with temperature control | PCB assembly, prototyping |
| Reflow Ovens | Infrared/convection heating for SMT soldering | Mass production of smartphones |
| Desoldering Pumps | Vacuum-based solder removal | Component replacement on motherboards |
| Hot Air Rework Stations | Precise thermal control for BGA/QFN packages | Repairing semiconductor chips |
| Smoke Extractors | Multi-stage filtration (HEPA/activated carbon) | Enclosed soldering workstations |
Soldering tools typically include a heating element, temperature sensor, and ergonomic handle. Rework stations integrate programmable thermal profiles and optical alignment systems. Fume extraction units consist of: - Inlet nozzle/arm for targeted capture - Pre-filter (dust collection) - HEPA filter (0.3 m particulate removal) - Activated carbon layer (gas/odor adsorption) - Industrial-grade centrifugal fan
| Parameter | Typical Range | Importance |
|---|---|---|
| Temperature Control | 200-480 C 1 C | Prevents thermal damage to components |
| Smoke Capture Efficiency | 99.9% for 0.5 m+ particles | Meets OSHA/REACH standards |
| CFM (Airflow Rate) | 80-300 CFM | Determines contaminant removal speed |
| Filter Lifespan | 500-2000 operating hours | Impacts maintenance costs |
| Thermal Recovery Time | <10 seconds | Maintains process continuity |
Key industries include: - Electronics manufacturing (SMT/BGA assembly) - Automotive (ECU repair, sensor calibration) - Aerospace (avionics maintenance) - Medical device production - Semiconductor packaging
Example: A smartphone PCB rework line uses hot air stations (BGA resoldering) with integrated smoke extraction achieving 99.95% particulate removal.
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Metcal | MX-5000 Soldering System | SmartHeat technology, 1 C stability |
| Hakko | FR-301 Desoldering Iron | 2-stage vacuum pump, 350 C in 15s |
| Cambridge Engineering | Series 7000 Smoke Extractor | 4-stage filtration, 250 CFM |
| ERSA | Versaflow 4/55 Selective Soldering | Modular design, nitrogen inerting |
Consider: - Process compatibility (e.g., lead-free solder requires 350 C) - Workspace constraints (arm length for extractors 80cm) - Energy efficiency (PWM-controlled heating elements) - Filter replacement costs (carbon saturation indicators) - Integration capabilities (IoT-enabled temperature logging)
Emerging developments: - AI-powered thermal profiling for predictive soldering - Nanofiber filters achieving 99.999% efficiency - Miniaturized on-tip heating elements for 0201 component work - Centralized extraction systems with real-time particle counters - Laser-assisted selective soldering for 5G RF modules