Flux, Flux Remover

Image	Part Number	Description / PDF	Quantity	Rfq
	63-0046-0952 Kester	SOLDER FLUX 952-D6	0
	ES132E ITW Chemtronics (Chemtronics)	CLEANER DEGREASER ELECT 1 GAL	0
	65-0004-0985 Kester	SOLDER FLUX 985M	0
	65-0002-2372 Kester	SOLDER FLUX NF372-TB	0
	63-0000-0715 Kester	SOLDER FLUX 715 1-GALLON	0
	63-0004-0985 Kester	SOLDER FLUX 985M	0
	63-0000-5520 Kester	FLUX 5520 COPPER-NU 1-GALLON	0
	65-0000-0817 Kester	SOLDER FLUX 817	0
	64-0001-8010 Kester	SELECT-10 SOLDER FLUX 5GAL	0
	83-0000-0144 Kester	ROSIN PASTE FLUX 2 OZ CAN	0
	63-0001-8010 Kester	SELECT-10 SOLDER FLUX 1GAL	0
	CW8710 ITW Chemtronics (Chemtronics)	FLUX - NO CLEAN LF TACKY	0
	57-0000-1553 Kester	PASTE FLUX NO-CLEAN 10GM SYR	0

Flux, Flux Remover

1. Overview

Flux and flux remover are critical materials in electronic manufacturing processes. Flux is a chemical agent used to remove oxidation from metal surfaces during soldering, enabling better solder wetting and joint formation. Flux remover (or flux cleaner) is a chemical solution designed to eliminate flux residues and contaminants from printed circuit boards (PCBs) after soldering. These materials ensure reliable electrical connections, prevent corrosion, and maintain product quality in modern electronics manufacturing.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Rosin-based Flux	Non-corrosive, low residue, compatible with lead-free and tin-lead solder	Consumer electronics assembly
Water-soluble Flux	High activity, easily removed with water-based cleaning	Automotive electronics with high reliability demands
No-clean Flux	Low residue formulation eliminating post-soldering cleaning	High-density PCB assembly
Organic Acid Flux	Strong oxide removal capability for difficult-to-solder surfaces	Industrial control equipment manufacturing
Solvent-based Remover	Fast evaporation, effective for rosin residues	Aerospace component maintenance
Water-based Remover	Environmentally friendly, meets RoHS/REACH standards	LED lighting production

3. Structure and Composition

Flux Composition:

Activators (e.g., organic/inorganic acids): Enhance metal wetting by removing oxides
Solvents (e.g., glycols, esters): Control viscosity and evaporation rate
Resin (e.g., colophony): Form protective layer against re-oxidation
Additives (e.g., surfactants): Improve thermal stability

Flux Remover Composition:

Base solvents (e.g., hydrocarbons, alcohols): Dissolve flux residues
Surfactants: Reduce surface tension for better penetration
Corrosion inhibitors: Protect metal surfaces during cleaning

4. Key Technical Specifications

Parameter	Description	Importance
Activation Temperature	100-350 C range	Determines compatibility with soldering profiles
Residue Conductivity	<1.56 S/cm	Impacts electrical reliability
Flash Point	30-80 C	Safety handling consideration
Cleaning Efficiency	>98% residue removal	Directly affects product yield
Material Compatibility	Pass MIL-STD-883H testing	Ensures no damage to sensitive components

5. Application Fields

Electronics Manufacturing: SMT/BGA assembly, wave soldering
Automotive Industry: Engine control units, sensor modules
Telecommunications: 5G base stations, fiber optic equipment
Aerospace: Avionics systems, satellite components
Medical Devices: Pacemakers, diagnostic equipment

Application Case: In smartphone PCB production, no-clean flux reduces cleaning costs by 40% while meeting IPC-J-STD-001 Class 3 requirements.

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Feature
Alpha Assembly	OM-350	Halogen-free no-clean flux with 0.03% solids
Kester	951CX	Water-soluble flux for high-reliability military applications
Henkel	RID810	Low-odor solvent-based flux remover
Electrolube	FS22	Biodegradable water-based cleaner

7. Selection Recommendations

Match flux type with solder alloy composition
Consider cleaning method (spray, ultrasonic, vapor degreasing)
Evaluate environmental regulations (VOC limits, REACH compliance)
Analyze thermal profile compatibility
Test material compatibility with PCB substrates

8. Industry Trends

Growth in halogen-free and bio-based formulations
Increased demand for ultra-low residue materials (<=0.01% solids)
Development of smart cleaning solutions with IoT-enabled monitoring
Rising adoption of miniaturized component-compatible fluxes
Integration with Industry 4.0 automated dispensing systems