Flux, Flux Remover

Image Part Number Description / PDF Quantity Rfq
MCC-SPR19A

MCC-SPR19A

MicroCare

SUPERCLEAN - HEAVY DUTY FLUX REM

14

CQ9LF

CQ9LF

Chip Quik, Inc.

LIQUID FLUX ROSIN MILDLY ACTIVAT

40

CQ2LF

CQ2LF

Chip Quik, Inc.

FLUX - WATER SOLUBLE PEN 0.34 OZ

189

FLS80-4G

FLS80-4G

SRA Soldering Products

#80 SOLVENT-BASED, WATER-SOL 4G

3

FLS300-1G

FLS300-1G

SRA Soldering Products

SRA #300 ORGANIC ACID FLUX - 1 G

1

TF5000-2CC-6

TF5000-2CC-6

SRA Soldering Products

TF5000 NO CLEAN TACKY FLUX - 2CC

10

NOVEC FLUX REMOVER

NOVEC FLUX REMOVER

3M

FLUX REMOVER AEROSOL CAN 12OZ

1046

8620

8620

ACL Staticide, Inc.

FLUX REMOVER CAN 12 OZ

9

RA891

RA891

Chip Quik, Inc.

ROSIN PASTE FLUX (RA) IN 2OZ FLA

173

DFW-V711

DFW-V711

CAIG Laboratories, Inc.

FLUX WASH, VAL-U SERIES

7

4140A-945ML

4140A-945ML

MG Chemicals

FLUX REMOVER FOR PC BOARDS

75

FLS99-20-4G

FLS99-20-4G

SRA Soldering Products

SRA #99-20 ROSIN FLUX RMA 4G

5

8622

8622

ACL Staticide, Inc.

ACL FLUX REMOVER LEAD-FREE

0

RX1900-4

RX1900-4

NTE Electronics, Inc.

FLUX REMOVER 4OZ W/BRUSH

136

FLS99-100ML

FLS99-100ML

SRA Soldering Products

#99 RMA ROSINFLUX - 100 ML, CHLO

0

CQIRM-0.5

CQIRM-0.5

Chip Quik, Inc.

FLUX REMOVER (FOAM FREE) IN 15ML

23

300214

300214

Kester

TSF-6852 15G SYR

0

1210679

1210679

LOCTITE / Henkel

LOCTITE MCF 800 5GAL PAIL

0

1124309

1124309

LOCTITE / Henkel

LOCTITE MF300 1GAL BTL

0

64-0000-0979

64-0000-0979

Kester

979 SOLDERING FLUX 5 GAL

0

Flux, Flux Remover

1. Overview

Flux and flux remover are critical materials in electronic manufacturing processes. Flux is a chemical agent used to remove oxidation from metal surfaces during soldering, enabling better solder wetting and joint formation. Flux remover (or flux cleaner) is a chemical solution designed to eliminate flux residues and contaminants from printed circuit boards (PCBs) after soldering. These materials ensure reliable electrical connections, prevent corrosion, and maintain product quality in modern electronics manufacturing.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Rosin-based FluxNon-corrosive, low residue, compatible with lead-free and tin-lead solderConsumer electronics assembly
Water-soluble FluxHigh activity, easily removed with water-based cleaningAutomotive electronics with high reliability demands
No-clean FluxLow residue formulation eliminating post-soldering cleaningHigh-density PCB assembly
Organic Acid FluxStrong oxide removal capability for difficult-to-solder surfacesIndustrial control equipment manufacturing
Solvent-based RemoverFast evaporation, effective for rosin residuesAerospace component maintenance
Water-based RemoverEnvironmentally friendly, meets RoHS/REACH standardsLED lighting production

3. Structure and Composition

Flux Composition:

  • Activators (e.g., organic/inorganic acids): Enhance metal wetting by removing oxides
  • Solvents (e.g., glycols, esters): Control viscosity and evaporation rate
  • Resin (e.g., colophony): Form protective layer against re-oxidation
  • Additives (e.g., surfactants): Improve thermal stability

Flux Remover Composition:

  • Base solvents (e.g., hydrocarbons, alcohols): Dissolve flux residues
  • Surfactants: Reduce surface tension for better penetration
  • Corrosion inhibitors: Protect metal surfaces during cleaning

4. Key Technical Specifications

ParameterDescriptionImportance
Activation Temperature100-350 C rangeDetermines compatibility with soldering profiles
Residue Conductivity<1.56 S/cmImpacts electrical reliability
Flash Point30-80 CSafety handling consideration
Cleaning Efficiency>98% residue removalDirectly affects product yield
Material CompatibilityPass MIL-STD-883H testingEnsures no damage to sensitive components

5. Application Fields

  • Electronics Manufacturing: SMT/BGA assembly, wave soldering
  • Automotive Industry: Engine control units, sensor modules
  • Telecommunications: 5G base stations, fiber optic equipment
  • Aerospace: Avionics systems, satellite components
  • Medical Devices: Pacemakers, diagnostic equipment

Application Case: In smartphone PCB production, no-clean flux reduces cleaning costs by 40% while meeting IPC-J-STD-001 Class 3 requirements.

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Feature
Alpha AssemblyOM-350Halogen-free no-clean flux with 0.03% solids
Kester951CXWater-soluble flux for high-reliability military applications
HenkelRID810Low-odor solvent-based flux remover
ElectrolubeFS22Biodegradable water-based cleaner

7. Selection Recommendations

  • Match flux type with solder alloy composition
  • Consider cleaning method (spray, ultrasonic, vapor degreasing)
  • Evaluate environmental regulations (VOC limits, REACH compliance)
  • Analyze thermal profile compatibility
  • Test material compatibility with PCB substrates

8. Industry Trends

  • Growth in halogen-free and bio-based formulations
  • Increased demand for ultra-low residue materials (<=0.01% solids)
  • Development of smart cleaning solutions with IoT-enabled monitoring
  • Rising adoption of miniaturized component-compatible fluxes
  • Integration with Industry 4.0 automated dispensing systems
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