Flux, Flux Remover

Part Number	Description / PDF	Quantity
RMA591NL Chip Quik, Inc.	RMA TACK FLUX FOR LEAD-FREE 10CC	47
CQ8LF-1.0 Chip Quik, Inc.	LIQUID FLUX ORGANIC ACID WATER-S	9
WS991 Chip Quik, Inc.	TACKY FLUX WATER-SOLUBLE 10CC SY	86
RSF-R80-8G CAIG Laboratories, Inc.	ROSIN SOLDERING FLUX, SYRINGE	24
FLS912-4G SRA Soldering Products	SRA #912 ROSIN FLUX, TYPE R - 4G	0
RSF-R39-8G CAIG Laboratories, Inc.	NO-CLEAN RMA SOLDERING FLUX, SYR	11
CQ7LF Chip Quik, Inc.	LIQUID FLUX ALCOHOL-BASED NO-CLE	66
FLS400-4G SRA Soldering Products	#400 NC FLUX, VOC-FREE 4% SOL	5
83-1001-8010 Kester	SELECT-10 NC ZERO HALOGEN FLUX	29
MCC-CBCSK MicroCare	CIRCUIT BOARD CLEANING KIT W/ SU	21
TF5000 SRA Soldering Products	TF5000 NO CLEAN TACKY FLUX - 10C	0
SMD291NL150G Chip Quik, Inc.	FLUX - NO CLEAN LF CAN 5.29 OZ	9
FLS80-1G SRA Soldering Products	#80 SOLVENT-BASED, WATER-SOL 1G	4
4140A-P MG Chemicals	FLUX REMOVER PEN- CARB COMPLIANT	17
FL22 EDSYN Inc.	FLUX GEL AND MINI FLOW TIP, 15ML	5
83-1000-0186 Kester	FLUX PEN FORMULA 186 RMA	944
CQ6RM-0.5 Chip Quik, Inc.	FOAMING FLUX REMOVER IN 15ML (0.	19
CQ8LF-0.5 Chip Quik, Inc.	LIQUID FLUX ORGANIC ACID WATER-S	34
ES835B ITW Chemtronics (Chemtronics)	FLUX REMOVER 5 OZ AEROSOL	37
CQ4LF-16 Chip Quik, Inc.	LIQUID FLUX NO-CLEAN IN 16OZ BOT	11

Flux, Flux Remover

1. Overview

Flux and flux remover are critical materials in electronic manufacturing processes. Flux is a chemical agent used to remove oxidation from metal surfaces during soldering, enabling better solder wetting and joint formation. Flux remover (or flux cleaner) is a chemical solution designed to eliminate flux residues and contaminants from printed circuit boards (PCBs) after soldering. These materials ensure reliable electrical connections, prevent corrosion, and maintain product quality in modern electronics manufacturing.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Rosin-based Flux	Non-corrosive, low residue, compatible with lead-free and tin-lead solder	Consumer electronics assembly
Water-soluble Flux	High activity, easily removed with water-based cleaning	Automotive electronics with high reliability demands
No-clean Flux	Low residue formulation eliminating post-soldering cleaning	High-density PCB assembly
Organic Acid Flux	Strong oxide removal capability for difficult-to-solder surfaces	Industrial control equipment manufacturing
Solvent-based Remover	Fast evaporation, effective for rosin residues	Aerospace component maintenance
Water-based Remover	Environmentally friendly, meets RoHS/REACH standards	LED lighting production

3. Structure and Composition

Flux Composition:

Activators (e.g., organic/inorganic acids): Enhance metal wetting by removing oxides
Solvents (e.g., glycols, esters): Control viscosity and evaporation rate
Resin (e.g., colophony): Form protective layer against re-oxidation
Additives (e.g., surfactants): Improve thermal stability

Flux Remover Composition:

Base solvents (e.g., hydrocarbons, alcohols): Dissolve flux residues
Surfactants: Reduce surface tension for better penetration
Corrosion inhibitors: Protect metal surfaces during cleaning

4. Key Technical Specifications

Parameter	Description	Importance
Activation Temperature	100-350 C range	Determines compatibility with soldering profiles
Residue Conductivity	<1.56 S/cm	Impacts electrical reliability
Flash Point	30-80 C	Safety handling consideration
Cleaning Efficiency	>98% residue removal	Directly affects product yield
Material Compatibility	Pass MIL-STD-883H testing	Ensures no damage to sensitive components

5. Application Fields

Electronics Manufacturing: SMT/BGA assembly, wave soldering
Automotive Industry: Engine control units, sensor modules
Telecommunications: 5G base stations, fiber optic equipment
Aerospace: Avionics systems, satellite components
Medical Devices: Pacemakers, diagnostic equipment

Application Case: In smartphone PCB production, no-clean flux reduces cleaning costs by 40% while meeting IPC-J-STD-001 Class 3 requirements.

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Feature
Alpha Assembly	OM-350	Halogen-free no-clean flux with 0.03% solids
Kester	951CX	Water-soluble flux for high-reliability military applications
Henkel	RID810	Low-odor solvent-based flux remover
Electrolube	FS22	Biodegradable water-based cleaner

7. Selection Recommendations

Match flux type with solder alloy composition
Consider cleaning method (spray, ultrasonic, vapor degreasing)
Evaluate environmental regulations (VOC limits, REACH compliance)
Analyze thermal profile compatibility
Test material compatibility with PCB substrates

8. Industry Trends

Growth in halogen-free and bio-based formulations
Increased demand for ultra-low residue materials (<=0.01% solids)
Development of smart cleaning solutions with IoT-enabled monitoring
Rising adoption of miniaturized component-compatible fluxes
Integration with Industry 4.0 automated dispensing systems