Accessories

Image Part Number Description / PDF Quantity Rfq
35941

35941

EMIT

ARM ADJUSTABLE FOR THE EXTRACTOR

0

400028EB

400028EB

EMIT

PCB, ALPHA/XBASE/FUME CUBE (INC.

0

133702EB

133702EB

EMIT

MAIN FILTER - SPECIAL HEPA TWIN

0

35942

35942

EMIT

FILTER REPL FOR THE EXTRACT 3/PK

0

420176EB

420176EB

EMIT

SPARES, GREEN SWITCH

0

630305EB

630305EB

EMIT

KNOB KNURLED M4X10 TORQUE

0

410136EB

410136EB

EMIT

IEC CHASSIS PLUG/FUSED 1 ART PT

0

111099-PVC

111099-PVC

EMIT

PRE-FILTER - LABYRINTH F8/F9, 15

0

113668EB

113668EB

EMIT

MAIN FILTER - SPECIAL HEPA CHEMI

0

113505H

113505H

EMIT

MAIN FILTER - HEPA CHEMICAL HYDR

0

110617EB

110617EB

EMIT

PRE-FILTER - PAD (SILICA), 1500I

0

100043EB

100043EB

EMIT

CONNECTION KIT, 50MM - 80MM X 6.

0

113670EB

113670EB

EMIT

MAIN FILTER - CHEMICAL PRINTING

0

630340EB

630340EB

EMIT

SPARES, SPEED CONTROL KNOB, ALPH

0

113505P

113505P

EMIT

MAIN FILTER - CHEMICAL ONLY

0

110537EB

110537EB

EMIT

MAIN FILTER - CHEMICAL ONLY FUME

0

110624EB

110624EB

EMIT

MAIN FILTER - HEAVY DUTY CHEMICA

0

110543EB

110543EB

EMIT

MN FLTR SLVNT LCK FUME CUBE

0

150398EB

150398EB

EMIT

FASCIA, 800I

0

105085EB

105085EB

EMIT

LOOM POWER FUME CUBE

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

RFQ BOM Call Skype Email
Top