Accessories

Image Part Number Description / PDF Quantity Rfq
200261

200261

EMIT

PRE-FILTER - CHEMICAL ABSORBENT

0

202260

202260

EMIT

PRE-FILTER - PAD 200/400 4PK

0

113662EB

113662EB

EMIT

MAIN FILTER - CSA

0

200316EB

200316EB

EMIT

PRE-FILTER - PAD F8/F9 4PK

0

200053EB

200053EB

EMIT

PRE-FILTER - EXHAUST PAD, FUMESA

0

202275

202275

EMIT

PRE-FILTER - LABYRINTH F8/F9 XBA

0

110545

110545

EMIT

MAIN FILTER - HEPA CHEMICAL XBAS

0

072116 - 2 ARMS

072116 - 2 ARMS

EMIT

FUMECUBE MAX 120V 38MM ARM KIT

0

110632EB

110632EB

EMIT

MAIN FILTER - HEPA CHEM CLNRM 15

0

072115 - 1 ARM

072115 - 1 ARM

EMIT

FUMECUBE MAX 230V 38MM ARM KIT

0

113805EB

113805EB

EMIT

MAIN FILTER - CHEMICAL REFILL CA

0

113800EB

113800EB

EMIT

MAIN FILTER - CHEMICAL ONLY CAPT

0

110533EB

110533EB

EMIT

MAIN FILTER - HEPA CHEMICAL CLEA

0

200281EB

200281EB

EMIT

PRE-FILTER - CHEMICAL ABSORBENT

0

202280EB

202280EB

EMIT

PRE-FILTER - LABYRINTH F6 800I 2

0

113669EB

113669EB

EMIT

MAIN FILTER - SPECIAL HEPA

0

072115 - 2 ARMS

072115 - 2 ARMS

EMIT

FUMECUBE MAX 230V 38MM ARM KIT

0

110616-PVC

110616-PVC

EMIT

MAIN FILTER - HEPA CHEMICAL 1500

0

430230EB

430230EB

EMIT

SPARES, SPINDLE ALPHA

0

110541EB

110541EB

EMIT

MAIN FILTER - SOLVENT LOCK

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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