Accessories

Image Part Number Description / PDF Quantity Rfq
110633EB

110633EB

EMIT

MAIN FILTER - HEPA ONLY 5000I

0

110532EB

110532EB

EMIT

MAIN FILTER - CHEMICAL ONLY

0

113652EB

113652EB

EMIT

MAIN FILTER - HEPA CHEMICAL 800I

0

113512EB

113512EB

EMIT

MAIN FILTER - HEPA CHEMICAL CLEA

0

110627EB

110627EB

EMIT

MAIN FILTER - CHEMICAL ONLY 5000

0

110536EB

110536EB

EMIT

MAIN FILTER - HEPA CHEMICAL FUME

4

100294EB

100294EB

EMIT

38MM FLEX ARM KIT SCREW FIX

0

113505EB

113505EB

EMIT

MAIN FILTER - HEPA CHEMICAL

2

202268EB

202268EB

EMIT

PRE-FILTER - LABYRINTH F6 2PK

5

113579EB

113579EB

EMIT

MAIN FILTER - HEPA TWIN CHEMICAL

2

202274EB

202274EB

EMIT

PRE-FILTER - LABYRINTH F8/F9 ALP

21

670001

670001

EMIT

REBALLING KIT, W/ NORTH AMERICA

0

110531EB

110531EB

EMIT

MAIN FILTER - HEPA CHEMICAL

0

100181EB

100181EB

EMIT

CAPTURE KIT FOR FUMEBUSTER, CONI

0

200275EB

200275EB

EMIT

PRE-FILTER, PAD, 800I (4/PACK)

0

100295EB

100295EB

EMIT

38MM S/S FLEX ARM KIT CLAMP FIX

0

202275EB

202275EB

EMIT

PRE-FILTER, LABYRINTH F8/F9, XBA

0

111124EB

111124EB

EMIT

PRE-FILTER - LABYRINTH F8/F9, FU

0

PNZ-AD

PNZ-AD

EMIT

NOZZLE ADAPTER FOR APR-1200-SRS

0

113585EB

113585EB

EMIT

MAIN FILTER - HEPA CSA XBASE

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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