Accessories

Image Part Number Description / PDF Quantity Rfq
670020

670020

EMIT

TRAINING KIT FOR SCORPION

0

200098EB

200098EB

EMIT

PRE-FILTER - PAD F8/F9 4PK

0

410125EB

410125EB

EMIT

POWER PLUG FUMECUBE/BUSTER 120V

0

113660EB

113660EB

EMIT

MAIN FILTER - HEPA TWIN CHEMICAL

0

113513EB

113513EB

EMIT

MAIN FILTER - SOLVENT LOCK 200/4

0

113651EB

113651EB

EMIT

MAIN FILTER - CHEMICAL ONLY 800I

0

111099EB

111099EB

EMIT

PRE-FILTER - LABYRINTH F8/F9, 15

0

APR-HHA

APR-HHA

EMIT

HEATER HEAD, REPLACEMENT, FOR AP

0

300595EB

300595EB

EMIT

BLOWER, 400/400I/400IPVC/800I, 2

0

100182EB

100182EB

EMIT

CAPTURE KIT FOR FUMEBUSTER, PLEN

0

200261EB

200261EB

EMIT

PRE-FILTER, CHEMICAL ABSORBENT P

0

113498EB

113498EB

EMIT

MAIN FILTER - HEPA CHEMICAL 400I

0

300592EB

300592EB

EMIT

BLOWER, 200/200I, 120V

0

113531EB

113531EB

EMIT

MAIN FILTER - PLEATED BAG

0

DTBK-USMD

DTBK-USMD

EMIT

FLUX DIP TRANS BLOCKS 2/PC

0

APR-SRS-UK3

APR-SRS-UK3

EMIT

SIDE-VIEW CAMERA FOR SCORPION

5

APR-2000-SCS

APR-2000-SCS

EMIT

SCARAB SITE CLEANING SYSTEM

0

100039EB

100039EB

EMIT

DUAL MANIFOLD KIT, 50MM - 80MM X

0

DTP-BGA

DTP-BGA

EMIT

FLUX DIP TRANSFER PLATES BGA

0

202273EB

202273EB

EMIT

PRE-FILTER - LABYRINTH F8/F9 2PK

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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