Accessories

Image Part Number Description / PDF Quantity Rfq
111144EB

111144EB

EMIT

PRE-FILTER - PLEATED BAG, 5000I

0

111037EB

111037EB

EMIT

PRE-FILTER - LABYRINTH F6, 1500I

0

100043CEB

100043CEB

EMIT

PVC CONN KIT 50-80 MM X 6.0 M

0

111006EB

111006EB

EMIT

PRE-FILTER - LABYRINTH F8/F9 TAG

0

13548

13548

EMIT

MAIN FILTER - CHEMICAL ONLY 650

0

120288EB

120288EB

EMIT

CONNECTION KIT, 100MM - 80MM X 2

0

111117EB

111117EB

EMIT

PRE-FILTER - LABYRINTH F8/F9, CA

0

105108EB

105108EB

EMIT

INTERFACING KIT, NO PLUG

0

113667EB

113667EB

EMIT

MAIN FILTER - SOLVENT LOCK 800I

0

110614EB

110614EB

EMIT

MAIN FILTER - HEPA TWIN CHEMICAL

0

200310EB

200310EB

EMIT

PRE-FILTER - PAD 5000I 4PK

0

110615EB

110615EB

EMIT

MAIN FILTER - HEPA CHEMICAL 1500

0

202260EB

202260EB

EMIT

PRE-FILTER, PAD, 200/400 (4/PACK

0

105108LEB

105108LEB

EMIT

INTERFACING KIT, NO PLUG, LONG (

0

DTP-CSP

DTP-CSP

EMIT

FLUX DIP TRANSFER PLATES CSP

0

890180EB

890180EB

EMIT

CASCADE, IN-LINE FILTER VACUUM C

0

840182EB

840182EB

EMIT

DELTA COWL (192MM X 5MM INLET)

0

19591

19591

EMIT

FILTER RPLC ION GUN PK OF 3

10

111072EB

111072EB

EMIT

PRE-FILTER - LABYRINTH F8, 5000I

0

113508EB

113508EB

EMIT

MAIN FILTER - CHEMICAL ONLY

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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