Accessories

Image Part Number Description / PDF Quantity Rfq
T0058741737

T0058741737

Xcelite

CSF Q 17,0X23,0 HEAD

0

T0053316499N

T0053316499N

Xcelite

WBH PCB HOLDER W/O TRIPOD

0

T0058762808N

T0058762808N

Xcelite

THROTTLE F. WFV 60 SPARE

0

FT-U

FT-U

Xcelite

BLACK NOZZLE, ESD, 190X100 MM

0

T0053657299N

T0053657299N

Xcelite

KIT1 WF NOZZLE 60 F. WFE S FUME

0

T0058765798N

T0058765798N

Xcelite

FE ADD-ON KIT TUBE 6.5MM WXP120

0

T0051394999

T0051394999

Xcelite

REPLACEMENT PIPE 1 FLOWINSMART 0

0

WB2

WB2

Xcelite

BUTANE FUEL, 1.0 OZ, UPS GRND,NO

23

T0058759769N

T0058759769N

Xcelite

CIRCUIT BOARD CONTROL WR 2

0

T0053640799

T0053640799

Xcelite

FILTER CARTRIDGE CARBON WFE2P

0

DS103

DS103

Xcelite

COLLECTOR TUBE ASSY

0

T0058762834

T0058762834

Xcelite

NOZZLE FOR WF 32 EXTRACTION ARM

0

KDS8301N

KDS8301N

Xcelite

ADAPTER 10CC

0

KDS301

KDS301

Xcelite

VACUUM PICKUP WAND KDS301

0

T0058735885

T0058735885

Xcelite

FINE-PARTICUL. FILTER F7 WFE 2S

0

0F07

0F07

Xcelite

FLEXIBLE, ADJUSTABLE ARM 0,7 M (

0

7875B

7875B

Xcelite

TIP 7875B

0

T0058766729

T0058766729

Xcelite

SUPPORT FOR ALLOY ANGLE WQB

0

10LL2

10LL2

Xcelite

STOPPER 10CC 1000/PK

0

T0058744724N

T0058744724N

Xcelite

HEATING ELEMENT FE 75

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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