Accessories

Image Part Number Description / PDF Quantity Rfq
PL120

PL120

Xcelite

REPLACEMENT PLUG AND RECEPTACLE

0

KDS20SC

KDS20SC

Xcelite

SCABBARD 20 GA 100/PK

0

10LL2PS

10LL2PS

Xcelite

STOPPER 10CC PLASTIC 1000/PK

0

T0056109399

T0056109399

Xcelite

W101H 100W SOLDER BATH 230V

0

DSTCP

DSTCP

Xcelite

DESOLDER ADAPTER TC201 SERIES

0

550C

550C

Xcelite

COLLARS/SCREWS FOR D550 WELLER

0

W58713798

W58713798

Xcelite

PART CSF RUBBER INSERT 798 10/PK

0

5LL2DRY

5LL2DRY

Xcelite

AIR STOPPER 5CC 1000/PK

0

3LL2M

3LL2M

Xcelite

STOPPER 3CC MANUAL 1000/PK

0

T7884

T7884

Xcelite

O-RING FOR 7880 7881 DESOLDER PU

0

30LL2PS

30LL2PS

Xcelite

STOPPER 30CC PLASTIC 1000/PK

0

T0053657399

T0053657399

Xcelite

WF FUNNEL NOZZLE 60 MM

0

PG151A

PG151A

Xcelite

PLASTIC ADAPTER 30 OZ. FOR PG151

0

T0053633899

T0053633899

Xcelite

CONNECTOR NIPPLE 53633899

0

T0051301399N

T0051301399N

Xcelite

ABW-2 EXTENSION SD1000

0

8200HEXCOL

8200HEXCOL

Xcelite

COLLAR HEX SCREW 8200

0

PU120T

PU120T

Xcelite

POWER UNIT 120V-WTCPT

0

T0058757809N

T0058757809N

Xcelite

HEATING CARTRIDGE HAP 3000 100/1

0

T0053631999

T0053631999

Xcelite

DOUBLE CONN SOCKET 50MM WFE20D

0

T0053124699N

T0053124699N

Xcelite

WTT1 TEMP MEASUREMENT 230V

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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