Accessories

Image Part Number Description / PDF Quantity Rfq
KDS8051N

KDS8051N

Xcelite

GASKET FOR ADAPTER 5CC

24

T0058741724

T0058741724

Xcelite

HEAD CSFD 5.8X10.5 58741724

0

T0058741736

T0058741736

Xcelite

CSF Q 17,0X17,0 HEAD

0

T0053659499

T0053659499

Xcelite

WFE 8S REPLACEMENT FILTER

0

T0058716794

T0058716794

Xcelite

REPLACEMENT HANDLE FOR FE75

0

T0053642199N

T0053642199N

Xcelite

FINE DUST FILTER F7 (3) WFE / WF

0

T0058736875N

T0058736875N

Xcelite

NA20 HOT AIR MEASURING NOZZLE

0

T0058735849

T0058735849

Xcelite

EXTRACT ARM DN40 A/ST 58735849

0

T0058741741

T0058741741

Xcelite

CSF QI 20.4X20.4 HEAD

0

T0052540999

T0052540999

Xcelite

CLEANING BRUSH FOR FE TUBE

0

T0058741723

T0058741723

Xcelite

CSF D 5.5X10.0 HEAD

0

T0058765772N

T0058765772N

Xcelite

CONICAL CLEANING INSERT WXDP/DSX

0

T0058747770

T0058747770

Xcelite

ADAPTER F. NQ NOZZLES WQB

0

A10LLPS

A10LLPS

Xcelite

STOPPER 10CC PLASTIC AIR SYRINGE

0

EC259B

EC259B

Xcelite

HEATER FOR EC1302B

0

ECMFE

ECMFE

Xcelite

FUME EXTRACT CLIP ATTACH EC1302

0

T0053637199

T0053637199

Xcelite

WFFMP 50 CONNECTOR

0

PES202

PES202

Xcelite

HANDLE/CORD ASSEMBLY FOR PES50

0

T0058759726N

T0058759726N

Xcelite

VACUUM FILTERS FOR WR3M / WR2 3

0

T0058751880

T0058751880

Xcelite

CAR ADAPTER 12V FOR WSM1C

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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