Accessories

Image Part Number Description / PDF Quantity Rfq
HE40

HE40

Xcelite

HEATER 40W FOR SP40 IRON

0

35472

35472

Tronex (Menda/EasyBraid/Tronex)

MAIN FILTER HEPA

2

35465

35465

Tronex (Menda/EasyBraid/Tronex)

FILTER CARBON FOR 35463

5421

72-07SU

72-07SU

Master Appliance Corp.

EJECTOR, SOLDER

0

7324

7324

Xcelite

SWITCH DUAL HEAT GUN

0

T0058744711N

T0058744711N

Xcelite

HEATER/SENSOR FOR WSP80

59

421A-125ML

421A-125ML

MG Chemicals

LIQUID TIN

14

890180EB

890180EB

EMIT

CASCADE, IN-LINE FILTER VACUUM C

0

MCC-101TX

MCC-101TX

MicroCare

MPM SUPERSAVER STENCIL WIPER

100

T0058768747N

T0058768747N

Xcelite

TNA NOZZLE ADAPTER

9

840182EB

840182EB

EMIT

DELTA COWL (192MM X 5MM INLET)

0

B1307

B1307

Hakko

CLEANING DRILL HOLDER

11

0CA10-4001

0CA10-4001

Kurtz Ersa, Inc.

EXTRACT ARM W/HINGE, 500MM HIGHF

1

KDS530SN

KDS530SN

Xcelite

ADAPTER HEAD 30CC

0

WP70S

WP70S

Xcelite

PYROPEN WP70S SOLDER EJEC

0

2906911

2906911

Phoenix Contact

PCB STOP FOR SOLDERING ONTO PCB

37

VCS-9-B

VCS-9-B

Chip Quik, Inc.

VACUUM TIP KIT FOR V8910

44

1237S

1237S

Xcelite

HEATER FOR THREAD-ON TIPS 33W

7

72-07TU

72-07TU

Master Appliance Corp.

EJECTOR, TORCH

0

SCN-PCSA

SCN-PCSA

Ideal-tek

NEW FRAME HOLDER FOR PCSA-2, PCS

10

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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