Accessories

Image Part Number Description / PDF Quantity Rfq
CS-ISB-14

CS-ISB-14

American Beauty Tools

HEATING ELEMENT CLEANER

10

B1086

B1086

Hakko

PIN,CLEANING,0.8MM NOZZLE,N3/802

44

SMD4.5NL

SMD4.5NL

Chip Quik, Inc.

REMOVAL ALLOY 4.5' LEAD FREE

14

19591

19591

EMIT

FILTER RPLC ION GUN PK OF 3

10

T0058735845N

T0058735845N

Xcelite

SHADE PC-TRANSP 200X100

0

111072EB

111072EB

EMIT

PRE-FILTER - LABYRINTH F8, 5000I

0

T0058744855N

T0058744855N

Xcelite

HEATING ELEMENT WP 80

17

113508EB

113508EB

EMIT

MAIN FILTER - CHEMICAL ONLY

0

T0052512599N

T0052512599N

Xcelite

FE ASSEMBLY FOR LR 21/TCP S

0

670020

670020

EMIT

TRAINING KIT FOR SCORPION

0

T0058762766

T0058762766

Xcelite

TPIECE 60MM WITH 2 CONNECTING PL

0

PT109MK

PT109MK

EDSYN Inc.

MAINTENANCE KIT FOR THE PT109

5

T0058762858

T0058762858

Xcelite

H13 PARTICLE FILTER AND GAS FILT

5

A1231

A1231

Hakko

PLATE,VALVE,2PK,808

28

200098EB

200098EB

EMIT

PRE-FILTER - PAD F8/F9 4PK

0

110049868

110049868

Steinel

SPARE ORIFICE FOR BUTANE TOOLS

12

410125EB

410125EB

EMIT

POWER PLUG FUMECUBE/BUSTER 120V

0

B1308

B1308

Hakko

DRILL BIT (10-PACK) 0.8MM

3

EB41E2020

EB41E2020

Tronex (Menda/EasyBraid/Tronex)

UNDER STENCIL WIPE 20"X20"

0

B3216

B3216

Hakko

ASSY,SLEEVE,YELLOW,LOCKING,A/B,F

211

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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