Accessories

Image Part Number Description / PDF Quantity Rfq
3LL2

3LL2

Xcelite

STOPPER 3CC 1000/PK

0

REM16

REM16

Chip Quik, Inc.

SMD / SMT CHIP REMOVAL ALLOY 16

9

B1306

B1306

Hakko

CLEANING DRILL HOLDER

8

S30T-2CH

S30T-2CH

Xcelite

STOPPER 30CC MANUAL

20

82-07U

82-07U

Master Appliance Corp.

EJECTOR

0

HE30

HE30

Xcelite

HEATER 30W FOR WP30 IRON

0

FASTCHIP32

FASTCHIP32

SRA Soldering Products

FAST CHIP REMOVAL ALLOY FOR SMD

6

T0058765766N

T0058765766N

Xcelite

BARREL FOR BENT XT TIPS WXP 120

8

UVO0000620

UVO0000620

Ideal-tek

SPARE ESD 6 MM CUPS FOR VAMPIRE

0

UVO0000830

UVO0000830

Ideal-tek

STRAIGHT NEEDLE, ESD 9 MM CUP

0

200310EB

200310EB

EMIT

PRE-FILTER - PAD 5000I 4PK

0

T0058744845N

T0058744845N

Xcelite

TIP RETAINER ASSY SHORT FOR WP80

48

B1309

B1309

Hakko

DRILL BITS 10PK

5

T0052704299N

T0052704299N

Xcelite

SOLDER BATH 150W 24V

0

PCSA-2

PCSA-2

Ideal-tek

PCB HOLDER PCSA-2 WITH ESD FOAM

2

EB41M1812

EB41M1812

Tronex (Menda/EasyBraid/Tronex)

UNDER STENCIL WIPE 18"X12"

0

B5142

B5142

Hakko

CLEANING DRILL HOLDER

19

LP20

LP20

EDSYN Inc.

COMPACT PORTABLE VACUUM TOOL

50

70-52U

70-52U

Master Appliance Corp.

CARRYING STRAP

0

T0058765778N

T0058765778N

Xcelite

GLASS TUBE WITH STRAP FOR WXDP 1

18

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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