Accessories

Image Part Number Description / PDF Quantity Rfq
B2880

B2880

Hakko

CAP,VACUUM OUTLET,W/O-RING,FM-20

0

A1578

A1578

Hakko

HEATER,2PK,FX-8804

0

C1235

C1235

Hakko

FEEDER,PEN,1.2-1.6MM,373

0

T0058750786N

T0058750786N

Xcelite

HOT GAS NOZZLE NQ 3.7X3.7 W. VAC

0

B1304/P

B1304/P

Hakko

DRILL,W/HOLDER,CLEANING,1.3MM,FR

0

B5054

B5054

Hakko

CORD,POWER,FR-810

0

503-H-V12

503-H-V12

Hakko

HEATER,503

0

T0058765799N

T0058765799N

Xcelite

FE ADD-ON KIT TUBE 6.5MM WXP 65

0

B5006

B5006

Hakko

SLEEVE,YELLOW,FX-1001

0

A1014

A1014

Hakko

PLATE,VALVE,PUMP,2PK,FR-400/FM-2

0

A5016

A5016

Hakko

HEATER,FR-4001

0

B5017

B5017

Hakko

PIPE,FILTER,FR-300

0

145-2012-ESDN

145-2012-ESDN

Xcelite

MIKRO/GASFILTER MG140,SOLVENTS/V

9

GD-80-2000N

GD-80-2000N

Xcelite

REPLACEMENT FILTER GD 80

0

888-062

888-062

Hakko

BIT,DRILL,HEATING CORE,FOR 888-0

0

485-61

485-61

Hakko

KEY-SWITCH,AH164-J3C33A,485

0

B3386

B3386

Hakko

PCB,FX-300

0

B3481

B3481

Hakko

ASSY,PIPE,GUIDE,0.6MM,FM-2027,37

0

B5052

B5052

Hakko

TURBINE,W/MOTOR,FR-810

0

A1374

A1374

Hakko

HEATER,980

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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