Accessories

Image Part Number Description / PDF Quantity Rfq
B2227

B2227

Hakko

PLATE,GROUNDING,TRANSFORMER,FX-8

0

485-52

485-52

Hakko

RUBBER SHEET,485

0

485-68

485-68

Hakko

TRANSFORMER,LG.,120V-100V,485

0

B1189

B1189

Hakko

WIRE,HEATER,851

0

B3429

B3429

Hakko

FRAME,PUMP,FM-204

0

FM2022-02

FM2022-02

Hakko

PARALLEL REMOVER,HANDPIECE ONLY,

0

B3215

B3215

Hakko

CONNECTOR,COVER,FM-2027

0

T0058735937

T0058735937

Xcelite

FINE DUST FILTER M5 2S/ZS4V (10)

0

B2085

B2085

Hakko

PLATE,DIAPHRAGH SETTING,FR-400/F

0

611-1/P

611-1/P

Hakko

STAND,SOLDER,REEL,611-1,GLD

0

999-216

999-216

Hakko

KIT,AIR HOSE,6MM OD,6FT LONG,FM-

0

A1068

A1068

Hakko

HEATER,851

0

B2124

B2124

Hakko

SWITCH,FEEDER,373

0

T0058741743

T0058741743

Xcelite

CSF QI 30,5X30,5 HEAD

0

B1075

B1075

Hakko

JOINT,ELBOW,FM-206/205,C1492

0

485-69

485-69

Hakko

BREAKER,485

0

700-3057

700-3057

Xcelite

REMOTE CONTROL MG-UNITS

3

A1174

A1174

Hakko

HEATER,24V-60W,807

0

999-178

999-178

Hakko

FILTER,PARTICULATE,HJ3100

0

485-67

485-67

Hakko

CHAMBER,W/SPACER & NUT & WASHER,

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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