Accessories

Image Part Number Description / PDF Quantity Rfq
T0058757026

T0058757026

Xcelite

CLAMPING NUT

0

B3449

B3449

Hakko

CHASSIS,W/RUBBER FOOT,FM-205

0

33-0001

33-0001

Techspray

PLATO ADAPTER - 3/16" PACE

0

B2798

B2798

Hakko

FOOT,RUBBER,4PK,C1492

0

B3348

B3348

Hakko

KNOB,FX-300

0

T0058762774

T0058762774

Xcelite

END CAP FOR EASY CLICK 060MM

0

777-076

777-076

Hakko

MOTOR,487

0

B2419

B2419

Hakko

CORD,POWER,FX-801/100/951,FR-400

0

T0052609899N

T0052609899N

Xcelite

EXTENSION CORD FOR IRON 80W 3M

5

B3726

B3726

Hakko

ASSY,PIPE,GUIDE,0.6 - 0.65MM,FM-

0

485-55

485-55

Hakko

TIMER,TD,1 SEC.,485

0

T0058768767

T0058768767

Xcelite

WT HUB

0

A1569

A1569

Hakko

HEATER,100-120V,FR-830

0

B2517

B2517

Hakko

PIPE,FILTER,W/FILTER HOLDER,807

0

BX1063

BX1063

Hakko

PLATE,FIXING,GUIDE PIPE,0.3-1.6M

0

BX1050

BX1050

Hakko

PIPE,GUIDE,0.5-1.0MM,HU-200

0

B2940

B2940

Hakko

PLUNGER,TRIGGER,GUN HANDLE,FM-20

0

B2965

B2965

Hakko

INLET,EXTERNAL AIR,FM-205/2024

0

999-256

999-256

Hakko

COUPLER,DUCT,3-IN,THRU-BENCH,FA-

0

375-03

375-03

Hakko

FEEDER,SOLDER,0.8MM,375

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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