Accessories

Image Part Number Description / PDF Quantity Rfq
B2253

B2253

Hakko

COVER,PORTABLE,905/910/915

0

B1902

B1902

Hakko

BOBBIN,SUPPORT,373

0

T0058735837

T0058735837

Xcelite

FINE-PART. FILTER F5 WFE4S/20D

0

B5062

B5062

Hakko

COVER,JOINT,FR-300

0

B1302/P

B1302/P

Hakko

DRILL,W/HOLDER,CLEANING,0.8MM,FR

0

B1215/P

B1215/P

Hakko

PIN,CLEANING,HEATER,817/808/807,

0

FT-PN

FT-PN

Xcelite

METAL NOZZLE 300 MM

0

777-156

777-156

Hakko

POT ONLY,699-030779,487

0

A1377

A1377

Hakko

HEATER,2PK,950

0

105098EB

105098EB

EMIT

INTERFACING KIT, 7-WAY LUMBERG

0

APR-SRS-UK2

APR-SRS-UK2

EMIT

IR PRE-HEAT SENSOR FOR SCORPION

0

B1853

B1853

Hakko

LED,851

0

B2919

B2919

Hakko

COLLECTOR,WASTE,FX-301B/300

0

T0058741732

T0058741732

Xcelite

CSF-D 11.0 X 26.5HEAD 58741732

0

A5054

A5054

Hakko

HEATER,29V-300W,FR-4003

0

B2295

B2295

Hakko

SPRING,TENSION,FX-8804,950

0

B1794

B1794

Hakko

NUT,ENCLOSURE,908/900L/N454/918/

0

T0058768727N

T0058768727N

Xcelite

WSRF 200 FUNNEL F. WSR 200/WDH 5

0

FIT0609

FIT0609

DFRobot

SIX ARM SOLDERING STATION

8

B2945

B2945

Hakko

SWITCH,PCB/LED,FM-2024

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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