Accessories

Image Part Number Description / PDF Quantity Rfq
113650EB

113650EB

EMIT

MAIN FILTER - HEPA ONLY 800I 3-T

0

3718

3718

Adafruit

HEAVY STAINLESS STEEL PCB HOLDER

36

T0053659899N

T0053659899N

Xcelite

WF STATIV EXTRACTION ARM

0

T0058744761N

T0058744761N

Xcelite

HEATING ELEMENT WSP 150

0

EB41D2424

EB41D2424

Tronex (Menda/EasyBraid/Tronex)

STNCL RLL DEK 24 CL .75 ID 30'

0

B1311

B1311

Hakko

DRILL BITS 10PK

7

999-201

999-201

Hakko

FILTER,PRE,EXTENDED LIFE,HJ3100

0

7882BK

7882BK

Xcelite

TIP FOR 7880 DESOLDER PUMP BULK

0

B3620

B3620

Hakko

ADAPTER,DUCT/B3642,FA-430

0

T0052921499N

T0052921499N

Xcelite

FE ADD ON KIT TUBE 06MM F. WX PE

0

B3218/P

B3218/P

Hakko

ASSY,SLEEVE,BLUE,LOCKING,A/B,FM-

0

B2149

B2149

Hakko

ASSY,PIPE,GUIDE,1.2MM,FX-8801,90

0

B3423

B3423

Hakko

TRANSFORMER,FM-205/204

0

B2942

B2942

Hakko

SPRING,GUN HANDLE,FM-2024

0

VNZ-ORINGK-XL

VNZ-ORINGK-XL

EMIT

O-RING ASST PACK VACUUM NOZZLE

0

B3729

B3729

Hakko

ASSY,PIPE,GUIDE,1.2MM,FM-2030,37

0

B1396

B1396

Hakko

VICE,MOUNTING,153/154/155

0

888-104

888-104

Hakko

KNOB,SCREW SET,699-031248,FR-870

0

B3042

B3042

Hakko

ASSY,CORD,FM-2022

0

B3113

B3113

Hakko

VALVE,GAS DISCHARGE,W/BLUE KNOB,

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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