Accessories

Image Part Number Description / PDF Quantity Rfq
B3656

B3656

Hakko

SWITCH,ZONE SELECTOR,FR-870B/872

0

B5056

B5056

Hakko

FP PICK-UP,W/SS WIRE,FR-810

0

B1313

B1313

Hakko

PIN,FILTER RETAINING,FR-400/FM-2

0

B3252

B3252

Hakko

ASSY,SWITCH CASE,FH-200/C1573

0

777-105

777-105

Hakko

FOOT,487

0

B2296

B2296

Hakko

PIN,STRUT,FX-8804,950

0

B3732

B3732

Hakko

PCB,W/FRONT PANEL&RECEPTACLE&BUT

0

T0058741803

T0058741803

Xcelite

CSF ADAPTER 06.0 DX

0

B3246

B3246

Hakko

METAL CLIP,FOR B1953,FM-2030/202

0

B2060

B2060

Hakko

SHAFT,CRANK,FR-400/FM-204,472D

0

B2974

B2974

Hakko

COVER,SLEEVE,FM-2026

0

T0058741730

T0058741730

Xcelite

CSF D 10.5X16.0 HEAD

0

B2030

B2030

Hakko

ASSY,CORD,ESD,907/908

0

888-085

888-085

Hakko

WRENCH,HEX,6MM,699-030837,C1392B

0

B2918

B2918

Hakko

TRAY,OVERFLOW,FX-301B/300

0

A1553

A1553

Hakko

HEATER,RIGHT SIDE,FX-300

0

B3024

B3024

Hakko

RACK,W/2 SCREWS,FX-781/780

0

T0058762846

T0058762846

Xcelite

FIXING CLAMP EXTRACTION ARM SPAR

0

PF-1000

PF-1000

Xcelite

PRE-FILTER MG100

0

B2948

B2948

Hakko

BUTTON,LOCK RELEASE,NOZZLE,FM-20

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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