RFI and EMI - Contacts, Fingerstock and Gaskets

Image Part Number Description / PDF Quantity Rfq
4053PA22101800

4053PA22101800

Laird - Performance Materials

GSKT FAB/FOAM 2.3X457.2MM DSHAPE

0

4202PA51H01024

4202PA51H01024

Laird - Performance Materials

GSKT FAB/FOAM 10" DSHAPE

49

0077009602

0077009602

Laird - Performance Materials

GASKET BECU 15.24X27.81MM

0

4096PA51H01800

4096PA51H01800

Laird - Performance Materials

GASKT FABRIC/FOAM 7X457.2MM RECT

0

0077002415

0077002415

Laird - Performance Materials

GASKET BECU 9.4X12.07MM

0

4110HA51H01800

4110HA51H01800

Laird - Performance Materials

D-SHAPE

0

0097065402

0097065402

Laird - Performance Materials

FINGERSTOCK BECU 1.6X304.8MM

198

4048PA51G01800

4048PA51G01800

Laird - Performance Materials

SQUARE

0

4C13PA51H01800

4C13PA51H01800

Laird - Performance Materials

GASKET FAB/FOAM 5X457.2MM DSHAPE

0

4520PA51H01800

4520PA51H01800

Laird - Performance Materials

GASKET FAB/FOAM 2.03X457.2MM SQ

0

67BCG2504303510R00

67BCG2504303510R00

Laird - Performance Materials

SP,CON,C,AU,TNR

0

0097054118

0097054118

Laird - Performance Materials

GASKET BECU 9.65X406.4MM

0

4056PA51H01800

4056PA51H01800

Laird - Performance Materials

GASKET FAB/FOAM 5.1X457.2MM RECT

248

4692PA22101800

4692PA22101800

Laird - Performance Materials

GSKT FAB/FOAM 6.4X457.2MM DSHAPE

0

0077007902

0077007902

Laird - Performance Materials

GASKET BECU 8.1X406.4MM

0

0077002902

0077002902

Laird - Performance Materials

GASKET BECU 20.32X8.7MM

0

0C97054002

0C97054002

Laird - Performance Materials

RFI EMI GROUNDING MATERIAL 25FT

0

4286PA51H01800

4286PA51H01800

Laird - Performance Materials

GASKET FAB/FOAM 10X457.2MM RECT

826

0097063202

0097063202

Laird - Performance Materials

FINGERSTOCK BECU 15.24X406.4MM

0

0077003302

0077003302

Laird - Performance Materials

GASKET BECU 9.4X406.40MM

0

RFI and EMI - Contacts, Fingerstock and Gaskets

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) systems require effective electromagnetic interference (EMI) and radio frequency interference (RFI) shielding to maintain signal integrity. Contacts, fingerstock, and gaskets are critical components for ensuring electrical continuity and shielding performance in electronic enclosures. These components prevent electromagnetic leakage while maintaining mechanical functionality in connectors, housings, and assemblies.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
ContactsConductive elements for maintaining electrical connections under compressionRF connectors, PCB grounding pads
FingerstockResilient metal strips with finger-like projections for continuous shieldingServer chassis, military equipment
GasketsConductive elastomers or mesh materials for sealing gapsAutomotive sensors, medical devices

3. Structure and Composition

Typical structures include:

  • Contacts: Beryllium copper or phosphor bronze cores with conductive platings (gold, silver, nickel)
  • Fingerstock: Canted coil springs or stamped metal fingers with corrosion-resistant coatings
  • Gaskets: Silicone rubber with embedded silver-aluminum particles or wire mesh

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance0.1-10 m Affects signal transmission efficiency
Shielding Effectiveness60-120 dB (100 MHz-10 GHz)Determines EMI/RFI attenuation
Compression Force0.5-5 N/mmImpacts mechanical durability
Temperature Range-55 C to +150 CDefines operational stability

5. Application Fields

Main industries include:

  • Telecommunications (5G base stations, microwave links)
  • Automotive (V2X communication systems, radar sensors)
  • Aerospace (avionics shielding compartments)
  • Medical (MRI shielding enclosures)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Parker ChomericsCHO-SEAL conductive gaskets
Laird Performance MaterialsForm-in-Place EMI gaskets
3MEMI Shielding Tapes 9703/9706
SamtecRFI/EMI shielded connectors

7. Selection Recommendations

Considerations include:

  • Frequency range of the application (higher frequencies require tighter tolerances)
  • Environmental conditions (temperature, humidity, chemical exposure)
  • Material compatibility (avoid galvanic corrosion between mating surfaces)
  • Cost-effectiveness (balance performance vs. budget constraints)

Case Study: In automotive radar systems, Parker Chomerics' silicone-based gaskets reduced EMI leakage by 40% compared to traditional metal fingerstock.

8. Industry Trends

Key development directions:

  • Miniaturization for 5G mmWave applications
  • Low-PIM (Passive Intermodulation) material formulations
  • Multi-functional integration with thermal management
  • RoHS-compliant plating processes (eliminating hexavalent chromium)
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