RFI and EMI - Contacts, Fingerstock and Gaskets

Image Part Number Description / PDF Quantity Rfq
4164PA51H01800

4164PA51H01800

Laird - Performance Materials

GASKET FAB/FOAM 19.1X457.2MM REC

642

4692PA51H01800

4692PA51H01800

Laird - Performance Materials

GSKT FAB/FOAM 6.4X457.2MM DSHAPE

3614

4209PA51G01800

4209PA51G01800

Laird - Performance Materials

GASKT FAB/FOAM 3.94X457.2MM RECT

0

0097053602

0097053602

Laird - Performance Materials

GASKET BECU 17X609.6MM

1968

0097094102

0097094102

Laird - Performance Materials

FINGERSTOCK BECU 5.1X609.6MM

0

4211PA51G01800

4211PA51G01800

Laird - Performance Materials

RECTANGLE

0

0077001202

0077001202

Laird - Performance Materials

GASKET BECU ALLOY 8.1X609.6MM

58

0077004202

0077004202

Laird - Performance Materials

GASKET BECU 7.11X18.54MM

0

0097098302

0097098302

Laird - Performance Materials

CARD GUI CLIPON BECU 2.03X9.53MM

9300

4629PA51H01800

4629PA51H01800

Laird - Performance Materials

GASKET FAB/FOAM 10X457.2MM RECT

0

0077005617

0077005617

Laird - Performance Materials

FINGERSTOCK BECU 8.1X406.4MM

0

4220PA51H01800

4220PA51H01800

Laird - Performance Materials

GASKET FAB/FOAM 5.1X457.2MM RECT

5499

4212PA22101800

4212PA22101800

Laird - Performance Materials

GASKET FAB/FOAM 4.95X457.2MM SQ

0

0097091502

0097091502

Laird - Performance Materials

FINGERSTOCK BECU 11.43X381MM

0

4787PA51H01800

4787PA51H01800

Laird - Performance Materials

GSKT FAB/FOAM 6.4X457.2MM DSHAPE

508

0077006602

0077006602

Laird - Performance Materials

FINGERSTOCK BECU 8.1X406.4MM

148

4630PA51H01800

4630PA51H01800

Laird - Performance Materials

GASKET FAB/FOAM 4.6X457.2MM BELL

0

4051PA51G01800

4051PA51G01800

Laird - Performance Materials

RECTANGLE

0

4055PA51H01800

4055PA51H01800

Laird - Performance Materials

GASKT FABRIC/FOAM 8X457.2MM RECT

0

4B88PA51H01800

4B88PA51H01800

Laird - Performance Materials

GASKT FABRIC/FOAM 8X457.2MM BELL

0

RFI and EMI - Contacts, Fingerstock and Gaskets

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) systems require effective electromagnetic interference (EMI) and radio frequency interference (RFI) shielding to maintain signal integrity. Contacts, fingerstock, and gaskets are critical components for ensuring electrical continuity and shielding performance in electronic enclosures. These components prevent electromagnetic leakage while maintaining mechanical functionality in connectors, housings, and assemblies.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
ContactsConductive elements for maintaining electrical connections under compressionRF connectors, PCB grounding pads
FingerstockResilient metal strips with finger-like projections for continuous shieldingServer chassis, military equipment
GasketsConductive elastomers or mesh materials for sealing gapsAutomotive sensors, medical devices

3. Structure and Composition

Typical structures include:

  • Contacts: Beryllium copper or phosphor bronze cores with conductive platings (gold, silver, nickel)
  • Fingerstock: Canted coil springs or stamped metal fingers with corrosion-resistant coatings
  • Gaskets: Silicone rubber with embedded silver-aluminum particles or wire mesh

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance0.1-10 m Affects signal transmission efficiency
Shielding Effectiveness60-120 dB (100 MHz-10 GHz)Determines EMI/RFI attenuation
Compression Force0.5-5 N/mmImpacts mechanical durability
Temperature Range-55 C to +150 CDefines operational stability

5. Application Fields

Main industries include:

  • Telecommunications (5G base stations, microwave links)
  • Automotive (V2X communication systems, radar sensors)
  • Aerospace (avionics shielding compartments)
  • Medical (MRI shielding enclosures)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Parker ChomericsCHO-SEAL conductive gaskets
Laird Performance MaterialsForm-in-Place EMI gaskets
3MEMI Shielding Tapes 9703/9706
SamtecRFI/EMI shielded connectors

7. Selection Recommendations

Considerations include:

  • Frequency range of the application (higher frequencies require tighter tolerances)
  • Environmental conditions (temperature, humidity, chemical exposure)
  • Material compatibility (avoid galvanic corrosion between mating surfaces)
  • Cost-effectiveness (balance performance vs. budget constraints)

Case Study: In automotive radar systems, Parker Chomerics' silicone-based gaskets reduced EMI leakage by 40% compared to traditional metal fingerstock.

8. Industry Trends

Key development directions:

  • Miniaturization for 5G mmWave applications
  • Low-PIM (Passive Intermodulation) material formulations
  • Multi-functional integration with thermal management
  • RoHS-compliant plating processes (eliminating hexavalent chromium)
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