RFI and EMI - Contacts, Fingerstock and Gaskets

Image Part Number Description / PDF Quantity Rfq
0097054202

0097054202

Laird - Performance Materials

GASKET BECU ALLOY 6.35X406.4MM

415

67B5G2504004108R00

67B5G2504004108R00

Laird - Performance Materials

SP,CON,5,AU,TNR

0

4200PA51G01800

4200PA51G01800

Laird - Performance Materials

RECTANGLE

0

0077007502

0077007502

Laird - Performance Materials

GASKET BECU 8.26X406.4MM

0

4789PA51H01800

4789PA51H01800

Laird - Performance Materials

GSKT FAB/FOAM 9.5X457.2MM DSHAPE

0

0077008802

0077008802

Laird - Performance Materials

GASKET BECU 14.3X37.5MM

0

4131PA51H01800

4131PA51H01800

Laird - Performance Materials

GASKT FAB/FOAM 12.7X457.2MM BELL

1097

4609PA51H01800

4609PA51H01800

Laird - Performance Materials

GSKT FAB/FOAM 10.16X457.2MM DSHP

404

0097050017

0097050017

Laird - Performance Materials

AP,STR,SNB,PSA

73

0077007002

0077007002

Laird - Performance Materials

GASKET BECU 8.1X406.4MM

0

4240PA51H01800

4240PA51H01800

Laird - Performance Materials

GASKT FAB/FOAM 7.62X457.2MM DSHP

0

4110HA51G01800

4110HA51G01800

Laird - Performance Materials

D-SHAPE

0

4609PA51G01800

4609PA51G01800

Laird - Performance Materials

GSKT FAB/FOAM 10.16X457.2MM DSHP

0

4795PA51H01800

4795PA51H01800

Laird - Performance Materials

GASKET FAB/FOAM 12.7X457.2MM REC

482

4742PA51H01800

4742PA51H01800

Laird - Performance Materials

GSKT FAB/FOAM 3.8X457.2MM DSHAPE

0

0097055517

0097055517

Laird - Performance Materials

FINGERSTOCK BECU 8.64X609.6MM

525

0D97098302

0D97098302

Laird - Performance Materials

FINGERSTOCK BECU 2.03X9.53MM

15377

0077009202

0077009202

Laird - Performance Materials

GASKET BECU 15.24X457.2MM

0

0077008102

0077008102

Laird - Performance Materials

GASKET BECU 7.11X609.6MM

474

0097097202

0097097202

Laird - Performance Materials

FINGERSTOCK BECU 1.6X304.8MM

5324

RFI and EMI - Contacts, Fingerstock and Gaskets

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) systems require effective electromagnetic interference (EMI) and radio frequency interference (RFI) shielding to maintain signal integrity. Contacts, fingerstock, and gaskets are critical components for ensuring electrical continuity and shielding performance in electronic enclosures. These components prevent electromagnetic leakage while maintaining mechanical functionality in connectors, housings, and assemblies.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
ContactsConductive elements for maintaining electrical connections under compressionRF connectors, PCB grounding pads
FingerstockResilient metal strips with finger-like projections for continuous shieldingServer chassis, military equipment
GasketsConductive elastomers or mesh materials for sealing gapsAutomotive sensors, medical devices

3. Structure and Composition

Typical structures include:

  • Contacts: Beryllium copper or phosphor bronze cores with conductive platings (gold, silver, nickel)
  • Fingerstock: Canted coil springs or stamped metal fingers with corrosion-resistant coatings
  • Gaskets: Silicone rubber with embedded silver-aluminum particles or wire mesh

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance0.1-10 m Affects signal transmission efficiency
Shielding Effectiveness60-120 dB (100 MHz-10 GHz)Determines EMI/RFI attenuation
Compression Force0.5-5 N/mmImpacts mechanical durability
Temperature Range-55 C to +150 CDefines operational stability

5. Application Fields

Main industries include:

  • Telecommunications (5G base stations, microwave links)
  • Automotive (V2X communication systems, radar sensors)
  • Aerospace (avionics shielding compartments)
  • Medical (MRI shielding enclosures)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Parker ChomericsCHO-SEAL conductive gaskets
Laird Performance MaterialsForm-in-Place EMI gaskets
3MEMI Shielding Tapes 9703/9706
SamtecRFI/EMI shielded connectors

7. Selection Recommendations

Considerations include:

  • Frequency range of the application (higher frequencies require tighter tolerances)
  • Environmental conditions (temperature, humidity, chemical exposure)
  • Material compatibility (avoid galvanic corrosion between mating surfaces)
  • Cost-effectiveness (balance performance vs. budget constraints)

Case Study: In automotive radar systems, Parker Chomerics' silicone-based gaskets reduced EMI leakage by 40% compared to traditional metal fingerstock.

8. Industry Trends

Key development directions:

  • Miniaturization for 5G mmWave applications
  • Low-PIM (Passive Intermodulation) material formulations
  • Multi-functional integration with thermal management
  • RoHS-compliant plating processes (eliminating hexavalent chromium)
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