RF Transceiver ICs

Image	Part Number	Description / PDF	Quantity	Rfq
	BCM4331KMLG Broadcom	IC RF TXRX WIFI SGL CHIP LO PCIE	0
	BCM43236TB1KML1WGT Broadcom	WLAN SINGLE CHIP 11N 2X2 DUALBAN	0
	BCM4360B0MKMLG Broadcom	SINGLE CHIP 3X3 11 AC	0
	BCM20730A2KML2G Broadcom	SINGLE-CHIP BLUETOOTH	0
	BCM20738A1KFBG Broadcom	IC RF TXRX+MCU 64VFBGA	0
	BCM43462SA01 Broadcom	3X3 802.11AC RADIO + ENTER	0
	BCM84722MAIFSBG Broadcom	DUAL CHANNEL 10GE	0
	BCM82792AKFSBG Broadcom	DUAL 100G GEARBOX FOR CR4/SR4/	0
	BCM4352ESC01 Broadcom	2X BCM43520KMLG +BCM53015 +ENT	0
	BCM43462KMLG Broadcom	SINGLE CHIP 3X3 11 AC	0
	BCM20733A2KML1G Broadcom	SINGLE-CHIP BLUETOOTH	0
	BCM8722CIFB Broadcom	TRANSCEIVER	0
	BCM4352ESF01 Broadcom	2X 43520KMLG+53016+UAP	0
	BCM84145BIFSBLG Broadcom	TRANSCEIVER	0
	BCM20771A0KWFBG Broadcom	SINGLE-CHIP BLUETOOTH PROCESSO	0
	BCM89335L2CUBG Broadcom	DUAL BAND+BT (IPA)	0
	BCM43222KFBG Broadcom	SINGLE CHIP WIRELESS	0
	BCM43436LXKUBG Broadcom	2.4G SINGLEBAND 802.11N BT4.1 FM	0
	BCM4352ESG01 Broadcom	2X43520IMLG+53016I+ESDK	0
	BCM4751IFBGT Broadcom	SINGLE CHIP GPS RECEIVER	0

RF Transceiver ICs

1. Overview

RF (Radio Frequency) and IF (Intermediate Frequency) transceiver ICs are integrated circuits that enable wireless communication by transmitting and receiving radio signals. These devices are critical in modern technologies, supporting applications from cellular networks to IoT (Internet of Things). RFID (Radio-Frequency Identification) RF transceivers specialize in short-range communication for identification and tracking systems. Their miniaturization, energy efficiency, and reliability have driven advancements in connectivity across industries.

2. Major Types and Functional Classification

Type	Functional Features	Application Examples
Low-Power RF Transceivers	Optimized for energy efficiency, supports sub-1GHz and 2.4GHz bands	IoT sensors, smart meters, wearable devices
High-Performance RF Transceivers	High output power (up to +20dBm), low phase noise	5G base stations, military communication systems
Multi-Band RF Transceivers	Supports multiple frequency bands (e.g., 400MHz-6GHz)	Dual-mode radios, global navigation systems
Integrated RFID Transceivers	Embedded protocol handling, on-chip modulation/demodulation	Inventory tracking, access control systems

3. Structure and Components

Typical RF transceiver ICs include:

Transmitter Section: Power Amplifier (PA), up-conversion mixer, frequency synthesizer
Receiver Section: Low-Noise Amplifier (LNA), down-conversion mixer, channel filter
Digital Baseband: ADC/DAC, error correction, protocol engine
Process Technology: CMOS, SiGe, or GaAs for high-frequency performance
Package Types: QFN (Quad Flat No-leads), BGA (Ball Grid Array)

4. Key Technical Specifications

Parameter	Description	Importance
Frequency Range	Operational bandwidth (e.g., 868MHz-915MHz, 2.4GHz-5.8GHz)	Determines application compatibility
Output Power	Transmit power level (e.g., -20dBm to +20dBm)	Impacts transmission distance and regulatory compliance
Receiver Sensitivity	Minimum detectable signal level (e.g., -120dBm)	Defines signal quality in noisy environments
Data Rate	Maximum throughput (e.g., 1Mbps-1Gbps)	Affects real-time data transmission capability
Power Consumption	Operating current/voltage requirements	Crucial for battery-powered devices

5. Application Areas

Telecommunications: 5G small cells, Wi-Fi 6 access points
Industrial IoT: Predictive maintenance sensors
Automotive: Tire Pressure Monitoring Systems (TPMS), keyless entry
Healthcare: Remote patient monitoring devices
Retail: Smart shelves with RFID inventory tracking

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
TI (Texas Instruments)	CC1352P	Sub-1GHz & 2.4GHz dual-band, +7dBm output power
Nordic Semiconductor	nRF52840	Bluetooth 5.2, 2.4GHz, 128-bit AES encryption
STMicroelectronics	S2-LP	Very low-power (14mA RX), sub-GHz transceiver
Infineon Technologies	BTS720	Automotive-grade RFID transceiver for immobilizers

7. Selection Guidelines

Key considerations include:

Frequency band alignment with regulatory standards (FCC, ETSI)
Power budget vs. transmission range requirements
Integration level (e.g., on-chip MCU, external PA needs)
Environmental factors (temperature range, EMI resilience)
Cost vs. performance trade-offs for mass production

8. Industry Trends

Future developments include:

Ultra-low-power designs for energy-harvesting IoT nodes
Massive MIMO integration for 6G infrastructure
AI-enhanced spectrum management algorithms
Expanded use of mmWave bands (24GHz+) for high-speed applications
Standardization of RFID protocols for global supply chains