RF Transceiver ICs

Image	Part Number	Description / PDF	Quantity	Rfq
	BCM20741A2KFB1G Broadcom	SINGLE-CHIP BLUETOOTH	0
	BCM43428KMLG Broadcom	SINGLE CHIP 2X2 SINGLE DUAL BAND	0
	BCM20740A2KFB1G Broadcom	SINGLE-CHIP BLUETOOTH	0
	BCM43236KMLG0 Broadcom	WLAN SINGLE CHIP 11N 2X2 - DUALB	0
	BCM4346SQ01 Broadcom	2X43460+VEGA+ENTERPRISE WL	0
	BCM4346SS01 Broadcom	2XENTERPRISE 11AC RADIO	0
	BCM4343SA02 Broadcom	3 STREAM DUAL RADIO BUNDLE FOR	0
	BCM20733A3KML1G Broadcom	SINGLE-CHIP BLUETOOTH	0
	BCM43526KMLGT Broadcom	SINGLE CHIP 3X3 11 AC	0
	BCM89335LCUBG Broadcom	DUAL BAND+BT (IPA)	0
	BCM4352ESW01 Broadcom	2X BCM43520IMLG +BCM5	0
	BCM20792KMLG Broadcom	SINGLE CHIP - NFC	0
	BCM43225SC01 Broadcom	43225 W/ SMIC SHIP	0
	BCM43225B0KMLWG Broadcom	SINGLE CHIP LOW PCIE	0
	BCM84722MAIFSBLG Broadcom	TRANSCEIVER	0
	BCM4352ESQ01 Broadcom	2X BCM43520 + BCM43428 + VEGA	0
	BCM84128AIFSBG Broadcom	TRANSCEIVER	0
	BCM43420A0KFBG Broadcom	IC WIRELESS SGL CHIP	0
	BCM43238KMLG Broadcom	WLAN SINGLE CHIP 11N 2X2 - DUA	0
	BCM20713A1KUBG Broadcom	SINGLE-CHIP BLUETOOTH	0

RF Transceiver ICs

1. Overview

RF (Radio Frequency) and IF (Intermediate Frequency) transceiver ICs are integrated circuits that enable wireless communication by transmitting and receiving radio signals. These devices are critical in modern technologies, supporting applications from cellular networks to IoT (Internet of Things). RFID (Radio-Frequency Identification) RF transceivers specialize in short-range communication for identification and tracking systems. Their miniaturization, energy efficiency, and reliability have driven advancements in connectivity across industries.

2. Major Types and Functional Classification

Type	Functional Features	Application Examples
Low-Power RF Transceivers	Optimized for energy efficiency, supports sub-1GHz and 2.4GHz bands	IoT sensors, smart meters, wearable devices
High-Performance RF Transceivers	High output power (up to +20dBm), low phase noise	5G base stations, military communication systems
Multi-Band RF Transceivers	Supports multiple frequency bands (e.g., 400MHz-6GHz)	Dual-mode radios, global navigation systems
Integrated RFID Transceivers	Embedded protocol handling, on-chip modulation/demodulation	Inventory tracking, access control systems

3. Structure and Components

Typical RF transceiver ICs include:

Transmitter Section: Power Amplifier (PA), up-conversion mixer, frequency synthesizer
Receiver Section: Low-Noise Amplifier (LNA), down-conversion mixer, channel filter
Digital Baseband: ADC/DAC, error correction, protocol engine
Process Technology: CMOS, SiGe, or GaAs for high-frequency performance
Package Types: QFN (Quad Flat No-leads), BGA (Ball Grid Array)

4. Key Technical Specifications

Parameter	Description	Importance
Frequency Range	Operational bandwidth (e.g., 868MHz-915MHz, 2.4GHz-5.8GHz)	Determines application compatibility
Output Power	Transmit power level (e.g., -20dBm to +20dBm)	Impacts transmission distance and regulatory compliance
Receiver Sensitivity	Minimum detectable signal level (e.g., -120dBm)	Defines signal quality in noisy environments
Data Rate	Maximum throughput (e.g., 1Mbps-1Gbps)	Affects real-time data transmission capability
Power Consumption	Operating current/voltage requirements	Crucial for battery-powered devices

5. Application Areas

Telecommunications: 5G small cells, Wi-Fi 6 access points
Industrial IoT: Predictive maintenance sensors
Automotive: Tire Pressure Monitoring Systems (TPMS), keyless entry
Healthcare: Remote patient monitoring devices
Retail: Smart shelves with RFID inventory tracking

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
TI (Texas Instruments)	CC1352P	Sub-1GHz & 2.4GHz dual-band, +7dBm output power
Nordic Semiconductor	nRF52840	Bluetooth 5.2, 2.4GHz, 128-bit AES encryption
STMicroelectronics	S2-LP	Very low-power (14mA RX), sub-GHz transceiver
Infineon Technologies	BTS720	Automotive-grade RFID transceiver for immobilizers

7. Selection Guidelines

Key considerations include:

Frequency band alignment with regulatory standards (FCC, ETSI)
Power budget vs. transmission range requirements
Integration level (e.g., on-chip MCU, external PA needs)
Environmental factors (temperature range, EMI resilience)
Cost vs. performance trade-offs for mass production

8. Industry Trends

Future developments include:

Ultra-low-power designs for energy-harvesting IoT nodes
Massive MIMO integration for 6G infrastructure
AI-enhanced spectrum management algorithms
Expanded use of mmWave bands (24GHz+) for high-speed applications
Standardization of RFID protocols for global supply chains