RF Transceiver ICs

Part Number	Description / PDF	Quantity
BCM43455XKUBG Broadcom	1X1 11AC BTFM COMBO	0
BCM43460KMLG Broadcom	IC RF TXRX WIFI SINGLE CHIP 3X3	90
BCM43236BKML1GT Broadcom	WLAN SINGLE CHIP 11N 2X2 - DUALB	0
BCM4352KMLG Broadcom	IC RF TXRX+MCU ISM>1GHZ	0
BCM4360KMLG Broadcom	IC RF TXRX WIFI SINGLE CHIP 3X3	62
BCM43520KMLG Broadcom	IC RF TXRX+MCU ISM>1GHZ	26
BCM11140IFEBG Broadcom	DUAL-A9 CPU, 14X14 PACKAGE, A3 V	0
BCM43455HKUBG Broadcom	1X1 11AC BTFM COMBO	0
BCM4360KMLGT Broadcom	SINGLE CHIP 3X3 11 AC	0
BCM43225KMLG Broadcom	SINGLE CHIP LOW PCIE	0
BCM43236KMLG Broadcom	WLAN SINGLE CHIP 11N 2X2 - DUA	0
BCM43566PKFFBG0 Broadcom	11AC DUAL-BAND 2X2 11AC USB FCBG	0
BCM43235KMLG Broadcom	WLAN SINGLE CHIP 11N 2X2 - DUA	0
BCM43236TBKML1WG Broadcom	WLAN SINGLE CHIP 11N 2X2 DUALBAN	0
BCM43236BKML1G Broadcom	WLAN SINGLE CHIP 11N 2X2 - DUALB	0
BCM43570EKFFBG Broadcom	DUAL BAND 2X2 (IPA) 11AC + BT W/	0
BCM4318KFBG Broadcom	SINGLE CHIP 802.11G MAC/BASEBA	0
BCM43238TBKMLWG Broadcom	WLAN SINGLE CHIP 11N 2X2 DUALBAN	0
BCM4358X3KWBG Broadcom	DUAL BAND MIMO:(IPA) 11AC/BT+P	0
BCM3410KMLG Broadcom	SINGLE CHANNEL QAM LNA	0

RF Transceiver ICs

1. Overview

RF (Radio Frequency) and IF (Intermediate Frequency) transceiver ICs are integrated circuits that enable wireless communication by transmitting and receiving radio signals. These devices are critical in modern technologies, supporting applications from cellular networks to IoT (Internet of Things). RFID (Radio-Frequency Identification) RF transceivers specialize in short-range communication for identification and tracking systems. Their miniaturization, energy efficiency, and reliability have driven advancements in connectivity across industries.

2. Major Types and Functional Classification

Type	Functional Features	Application Examples
Low-Power RF Transceivers	Optimized for energy efficiency, supports sub-1GHz and 2.4GHz bands	IoT sensors, smart meters, wearable devices
High-Performance RF Transceivers	High output power (up to +20dBm), low phase noise	5G base stations, military communication systems
Multi-Band RF Transceivers	Supports multiple frequency bands (e.g., 400MHz-6GHz)	Dual-mode radios, global navigation systems
Integrated RFID Transceivers	Embedded protocol handling, on-chip modulation/demodulation	Inventory tracking, access control systems

3. Structure and Components

Typical RF transceiver ICs include:

Transmitter Section: Power Amplifier (PA), up-conversion mixer, frequency synthesizer
Receiver Section: Low-Noise Amplifier (LNA), down-conversion mixer, channel filter
Digital Baseband: ADC/DAC, error correction, protocol engine
Process Technology: CMOS, SiGe, or GaAs for high-frequency performance
Package Types: QFN (Quad Flat No-leads), BGA (Ball Grid Array)

4. Key Technical Specifications

Parameter	Description	Importance
Frequency Range	Operational bandwidth (e.g., 868MHz-915MHz, 2.4GHz-5.8GHz)	Determines application compatibility
Output Power	Transmit power level (e.g., -20dBm to +20dBm)	Impacts transmission distance and regulatory compliance
Receiver Sensitivity	Minimum detectable signal level (e.g., -120dBm)	Defines signal quality in noisy environments
Data Rate	Maximum throughput (e.g., 1Mbps-1Gbps)	Affects real-time data transmission capability
Power Consumption	Operating current/voltage requirements	Crucial for battery-powered devices

5. Application Areas

Telecommunications: 5G small cells, Wi-Fi 6 access points
Industrial IoT: Predictive maintenance sensors
Automotive: Tire Pressure Monitoring Systems (TPMS), keyless entry
Healthcare: Remote patient monitoring devices
Retail: Smart shelves with RFID inventory tracking

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
TI (Texas Instruments)	CC1352P	Sub-1GHz & 2.4GHz dual-band, +7dBm output power
Nordic Semiconductor	nRF52840	Bluetooth 5.2, 2.4GHz, 128-bit AES encryption
STMicroelectronics	S2-LP	Very low-power (14mA RX), sub-GHz transceiver
Infineon Technologies	BTS720	Automotive-grade RFID transceiver for immobilizers

7. Selection Guidelines

Key considerations include:

Frequency band alignment with regulatory standards (FCC, ETSI)
Power budget vs. transmission range requirements
Integration level (e.g., on-chip MCU, external PA needs)
Environmental factors (temperature range, EMI resilience)
Cost vs. performance trade-offs for mass production

8. Industry Trends

Future developments include:

Ultra-low-power designs for energy-harvesting IoT nodes
Massive MIMO integration for 6G infrastructure
AI-enhanced spectrum management algorithms
Expanded use of mmWave bands (24GHz+) for high-speed applications
Standardization of RFID protocols for global supply chains