RF Directional Coupler

Image Part Number Description / PDF Quantity Rfq
DXP18CN7515TL

DXP18CN7515TL

TOKO / Murata

RF DIR COUPLER 50MHZ-870MHZ 0603

2672

DXP18CN7510TL

DXP18CN7510TL

TOKO / Murata

RF DIR COUPLER 50MHZ-870MHZ 0603

0

LDC21881M10B-028

LDC21881M10B-028

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

LDC21836M14D-163

LDC21836M14D-163

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

LDC181G9513B-320

LDC181G9513B-320

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0603

0

LDC182G4510B-325

LDC182G4510B-325

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0603

0

LDC21897M19D-079

LDC21897M19D-079

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

LDC181G9519B-327

LDC181G9519B-327

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0603

0

LDC311G7410B-004

LDC311G7410B-004

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1206

0

LDC311G6003B-601

LDC311G6003B-601

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1206

0

LDC212G4518B-041

LDC212G4518B-041

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

LDC21897M19E-157

LDC21897M19E-157

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

LDC311G9613B-711

LDC311G9613B-711

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1206

0

LDC311G9610B-004

LDC311G9610B-004

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1206

0

LDC312G1403B-769

LDC312G1403B-769

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1206

0

LDC312G1519B-720

LDC312G1519B-720

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1206

0

LDC211G8814B-027

LDC211G8814B-027

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

LDC431G6003B-200

LDC431G6003B-200

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1812

0

LDC32900M03B-703

LDC32900M03B-703

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1210

0

LDC21836M20B-027

LDC21836M20B-027

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

RF Directional Coupler

1. Overview

Directional couplers are passive devices that sample a portion of RF/IF signal power for monitoring or feedback purposes. They enable signal splitting, reflection measurement, and signal-to-noise ratio optimization. These components are critical in wireless communication systems, RFID infrastructure, and industrial control applications.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microwave Ridge WaveguideHigh power handling (100W+), broadband operation5G Base stations, Satellite communication
Coaxial LineCompact design, 50/75 impedance optionsRFID readers, Test equipment
Microstrip PlanarLow profile, Surface-mount compatibleWLAN routers, IoT modules
Hybrid Coupler3dB power split with phase matchingMIMO systems, Beamforming networks

3. Structure and Components

Typical construction includes: - Precision-machined metal housing (aluminum/copper alloys) - Dielectric substrates (PTFE or ceramic materials) - Coupling slots/apertures (0.1-2.0mm dimensions) - Input/Output ports with SMA/N-Type connectors - Isolation termination resistor (50 matched load) - EMI shielding gaskets

4. Key Technical Specifications

ParameterTypical RangeImportance
Coupling Factor3-40 dBDetermines sampled power level
Directivity15-40 dBMeasures forward/reverse signal separation
Insertion Loss0.1-2.0 dBImpacts system power efficiency
VSWR1.1:1 - 1.5:1Affects impedance matching quality
Frequency Range30 MHz - 110 GHzDefines operational bandwidth

5. Application Fields

Key industries include: - Telecommunications (5G/4G BTS signal monitoring) - RFID systems (UHF/NFC reader sensitivity control) - Industrial IoT (Wireless sensor network optimization) - Medical equipment (MRI RF power management) - Automotive (V2X communication diagnostics)

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Analog DevicesADL552340GHz broadband, 20dB coupling accuracy
Mini-CircuitsZFDC-20-63-S+DC-20GHz, 3.5mm connectorized
TE ConnectivityRF-0424-01Automotive-grade RFID coupler
KRYTAR1010480010-48GHz, 50dB dynamic range

7. Selection Guidelines

Key considerations: - Frequency bandwidth match (1.5x operating range) - Power handling (1.2x maximum system power) - Directivity requirements (>30dB for precise measurements) - Environmental factors (operating temperature -40 C to +85 C) - Connector type compatibility (SMA vs N-Type) - Cost vs performance tradeoff (planar vs waveguide)

8. Industry Trends

Emerging developments: - Sub-6GHz massive MIMO integration - Advanced packaging for mmWave applications - AI-optimized coupling algorithms - Gallium Nitride (GaN) material adoption - Miniaturization for mobile device integration - Higher directivity (>50dB) research

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