RF Directional Coupler

Image Part Number Description / PDF Quantity Rfq
LDC31888M10B-002

LDC31888M10B-002

TOKO / Murata

MULTI-LAY HYBRID COUPLER 10DB

0

LDC311G7414B-001

LDC311G7414B-001

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1206

0

LDC43850M03B-401

LDC43850M03B-401

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1812

0

LDC311G8814B-001

LDC311G8814B-001

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1206

0

LDC211G9513B-027

LDC211G9513B-027

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

LDC211G8820B-042

LDC211G8820B-042

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

LDC18836M20B-320

LDC18836M20B-320

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0603

0

LDC21897M20H-056

LDC21897M20H-056

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

LDC211G9517B-031

LDC211G9517B-031

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

LDC21897M10B-028

LDC21897M10B-028

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

LDC311G8503B-601

LDC311G8503B-601

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1206

0

LDC182G4512B-320

LDC182G4512B-320

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0603

0

LDC31847M10B-749

LDC31847M10B-749

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1206

0

LDC211G9518H-073

LDC211G9518H-073

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

LDC21815M20B-027

LDC21815M20B-027

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

LDC181G8819B-327

LDC181G8819B-327

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0603

0

LDC21924M19B-027

LDC21924M19B-027

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

LDC211G7412B-032

LDC211G7412B-032

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

LDC212G1410B-038

LDC212G1410B-038

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

LDC311G9603B-767

LDC311G9603B-767

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1206

0

RF Directional Coupler

1. Overview

Directional couplers are passive devices that sample a portion of RF/IF signal power for monitoring or feedback purposes. They enable signal splitting, reflection measurement, and signal-to-noise ratio optimization. These components are critical in wireless communication systems, RFID infrastructure, and industrial control applications.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microwave Ridge WaveguideHigh power handling (100W+), broadband operation5G Base stations, Satellite communication
Coaxial LineCompact design, 50/75 impedance optionsRFID readers, Test equipment
Microstrip PlanarLow profile, Surface-mount compatibleWLAN routers, IoT modules
Hybrid Coupler3dB power split with phase matchingMIMO systems, Beamforming networks

3. Structure and Components

Typical construction includes: - Precision-machined metal housing (aluminum/copper alloys) - Dielectric substrates (PTFE or ceramic materials) - Coupling slots/apertures (0.1-2.0mm dimensions) - Input/Output ports with SMA/N-Type connectors - Isolation termination resistor (50 matched load) - EMI shielding gaskets

4. Key Technical Specifications

ParameterTypical RangeImportance
Coupling Factor3-40 dBDetermines sampled power level
Directivity15-40 dBMeasures forward/reverse signal separation
Insertion Loss0.1-2.0 dBImpacts system power efficiency
VSWR1.1:1 - 1.5:1Affects impedance matching quality
Frequency Range30 MHz - 110 GHzDefines operational bandwidth

5. Application Fields

Key industries include: - Telecommunications (5G/4G BTS signal monitoring) - RFID systems (UHF/NFC reader sensitivity control) - Industrial IoT (Wireless sensor network optimization) - Medical equipment (MRI RF power management) - Automotive (V2X communication diagnostics)

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Analog DevicesADL552340GHz broadband, 20dB coupling accuracy
Mini-CircuitsZFDC-20-63-S+DC-20GHz, 3.5mm connectorized
TE ConnectivityRF-0424-01Automotive-grade RFID coupler
KRYTAR1010480010-48GHz, 50dB dynamic range

7. Selection Guidelines

Key considerations: - Frequency bandwidth match (1.5x operating range) - Power handling (1.2x maximum system power) - Directivity requirements (>30dB for precise measurements) - Environmental factors (operating temperature -40 C to +85 C) - Connector type compatibility (SMA vs N-Type) - Cost vs performance tradeoff (planar vs waveguide)

8. Industry Trends

Emerging developments: - Sub-6GHz massive MIMO integration - Advanced packaging for mmWave applications - AI-optimized coupling algorithms - Gallium Nitride (GaN) material adoption - Miniaturization for mobile device integration - Higher directivity (>50dB) research

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