RF Directional Coupler

Image Part Number Description / PDF Quantity Rfq
LDC312G5003B-743

LDC312G5003B-743

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1206

0

LDC21897M14B-029

LDC21897M14B-029

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

LDC31902M20B-001

LDC31902M20B-001

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1206

0

LDC431G9003B-200

LDC431G9003B-200

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1812

0

LDC182G4517B-327

LDC182G4517B-327

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0603

0

LDC432G1003B-200

LDC432G1003B-200

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1812

0

LDC18897M20B-320

LDC18897M20B-320

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0603

0

LDC212G1419B-042

LDC212G1419B-042

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

LDC21897M19D-078

LDC21897M19D-078

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

LDC212G4512B-027

LDC212G4512B-027

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

LDC311G9503B-768

LDC311G9503B-768

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1206

0

LDC211G4416B-027

LDC211G4416B-027

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

LDC18897M18B-325

LDC18897M18B-325

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0603

0

LDC432G5003B-200

LDC432G5003B-200

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1812

0

LDC181G8814B-320

LDC181G8814B-320

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0603

0

LDC181G9520B-328

LDC181G9520B-328

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0603

0

LDC212G4520H-151

LDC212G4520H-151

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

LDC312G2503B-723

LDC312G2503B-723

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1206

0

LDC312G1510B-719

LDC312G1510B-719

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1206

0

LDC312G1410B-776

LDC312G1410B-776

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1206

0

RF Directional Coupler

1. Overview

Directional couplers are passive devices that sample a portion of RF/IF signal power for monitoring or feedback purposes. They enable signal splitting, reflection measurement, and signal-to-noise ratio optimization. These components are critical in wireless communication systems, RFID infrastructure, and industrial control applications.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microwave Ridge WaveguideHigh power handling (100W+), broadband operation5G Base stations, Satellite communication
Coaxial LineCompact design, 50/75 impedance optionsRFID readers, Test equipment
Microstrip PlanarLow profile, Surface-mount compatibleWLAN routers, IoT modules
Hybrid Coupler3dB power split with phase matchingMIMO systems, Beamforming networks

3. Structure and Components

Typical construction includes: - Precision-machined metal housing (aluminum/copper alloys) - Dielectric substrates (PTFE or ceramic materials) - Coupling slots/apertures (0.1-2.0mm dimensions) - Input/Output ports with SMA/N-Type connectors - Isolation termination resistor (50 matched load) - EMI shielding gaskets

4. Key Technical Specifications

ParameterTypical RangeImportance
Coupling Factor3-40 dBDetermines sampled power level
Directivity15-40 dBMeasures forward/reverse signal separation
Insertion Loss0.1-2.0 dBImpacts system power efficiency
VSWR1.1:1 - 1.5:1Affects impedance matching quality
Frequency Range30 MHz - 110 GHzDefines operational bandwidth

5. Application Fields

Key industries include: - Telecommunications (5G/4G BTS signal monitoring) - RFID systems (UHF/NFC reader sensitivity control) - Industrial IoT (Wireless sensor network optimization) - Medical equipment (MRI RF power management) - Automotive (V2X communication diagnostics)

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Analog DevicesADL552340GHz broadband, 20dB coupling accuracy
Mini-CircuitsZFDC-20-63-S+DC-20GHz, 3.5mm connectorized
TE ConnectivityRF-0424-01Automotive-grade RFID coupler
KRYTAR1010480010-48GHz, 50dB dynamic range

7. Selection Guidelines

Key considerations: - Frequency bandwidth match (1.5x operating range) - Power handling (1.2x maximum system power) - Directivity requirements (>30dB for precise measurements) - Environmental factors (operating temperature -40 C to +85 C) - Connector type compatibility (SMA vs N-Type) - Cost vs performance tradeoff (planar vs waveguide)

8. Industry Trends

Emerging developments: - Sub-6GHz massive MIMO integration - Advanced packaging for mmWave applications - AI-optimized coupling algorithms - Gallium Nitride (GaN) material adoption - Miniaturization for mobile device integration - Higher directivity (>50dB) research

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