RF Directional Coupler

Image Part Number Description / PDF Quantity Rfq
CP0603A0700RNTR

CP0603A0700RNTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0805A1280BWTR\500

CP0805A1280BWTR\500

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0603A2140GNTR

CP0603A2140GNTR

Elco (AVX)

DIRECTIONAL COUPLER

0

LDC21924M19B-027

LDC21924M19B-027

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

CP0603A2420GLTR

CP0603A2420GLTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0805B1975CSTR

CP0805B1975CSTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0402A3500BNTR

CP0402A3500BNTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0603A2400HNTR

CP0603A2400HNTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0603A1880BWTR

CP0603A1880BWTR

Elco (AVX)

DIRECTIONAL COUPLER

0

0898CP14C0035T

0898CP14C0035T

Johanson Technology

RF DIR COUPLER 89MHZ 0603

0

CP0805A0942ASTR

CP0805A0942ASTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0603A1890MNTR

CP0603A1890MNTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0805D0836VWTR

CP0805D0836VWTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0603A1441FNTR

CP0603A1441FNTR

Elco (AVX)

DIRECTIONAL COUPLER

0

LDC211G7412B-032

LDC211G7412B-032

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

CP0402A1441ANTR

CP0402A1441ANTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0402A2140ENTR

CP0402A2140ENTR

Elco (AVX)

DIRECTIONAL COUPLER

0

LDC212G1410B-038

LDC212G1410B-038

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

CP0603A0836HNTR\10K

CP0603A0836HNTR\10K

Elco (AVX)

DIRECTIONAL COUPLER

0

1P510S

1P510S

Anaren

RF DIR COUPLER 1.7GHZ-2GHZ SMD

0

RF Directional Coupler

1. Overview

Directional couplers are passive devices that sample a portion of RF/IF signal power for monitoring or feedback purposes. They enable signal splitting, reflection measurement, and signal-to-noise ratio optimization. These components are critical in wireless communication systems, RFID infrastructure, and industrial control applications.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microwave Ridge WaveguideHigh power handling (100W+), broadband operation5G Base stations, Satellite communication
Coaxial LineCompact design, 50/75 impedance optionsRFID readers, Test equipment
Microstrip PlanarLow profile, Surface-mount compatibleWLAN routers, IoT modules
Hybrid Coupler3dB power split with phase matchingMIMO systems, Beamforming networks

3. Structure and Components

Typical construction includes: - Precision-machined metal housing (aluminum/copper alloys) - Dielectric substrates (PTFE or ceramic materials) - Coupling slots/apertures (0.1-2.0mm dimensions) - Input/Output ports with SMA/N-Type connectors - Isolation termination resistor (50 matched load) - EMI shielding gaskets

4. Key Technical Specifications

ParameterTypical RangeImportance
Coupling Factor3-40 dBDetermines sampled power level
Directivity15-40 dBMeasures forward/reverse signal separation
Insertion Loss0.1-2.0 dBImpacts system power efficiency
VSWR1.1:1 - 1.5:1Affects impedance matching quality
Frequency Range30 MHz - 110 GHzDefines operational bandwidth

5. Application Fields

Key industries include: - Telecommunications (5G/4G BTS signal monitoring) - RFID systems (UHF/NFC reader sensitivity control) - Industrial IoT (Wireless sensor network optimization) - Medical equipment (MRI RF power management) - Automotive (V2X communication diagnostics)

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Analog DevicesADL552340GHz broadband, 20dB coupling accuracy
Mini-CircuitsZFDC-20-63-S+DC-20GHz, 3.5mm connectorized
TE ConnectivityRF-0424-01Automotive-grade RFID coupler
KRYTAR1010480010-48GHz, 50dB dynamic range

7. Selection Guidelines

Key considerations: - Frequency bandwidth match (1.5x operating range) - Power handling (1.2x maximum system power) - Directivity requirements (>30dB for precise measurements) - Environmental factors (operating temperature -40 C to +85 C) - Connector type compatibility (SMA vs N-Type) - Cost vs performance tradeoff (planar vs waveguide)

8. Industry Trends

Emerging developments: - Sub-6GHz massive MIMO integration - Advanced packaging for mmWave applications - AI-optimized coupling algorithms - Gallium Nitride (GaN) material adoption - Miniaturization for mobile device integration - Higher directivity (>50dB) research

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