RF Directional Coupler

Image Part Number Description / PDF Quantity Rfq
CP0603A3100HNTR

CP0603A3100HNTR

Elco (AVX)

DIRECTIONAL COUPLER

0

LDC211G8820B-042

LDC211G8820B-042

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

CPL-5232-10-TNC-79

CPL-5232-10-TNC-79

Vitelec / Cinch Connectivity Solutions

RF DIR COUPLER 2GHZ-18GHZ

0

CP0603A2100CNTR

CP0603A2100CNTR

Elco (AVX)

DIRECTIONAL COUPLER

0

X3C07P1-04S

X3C07P1-04S

Anaren

RF DIR COUPLER 600MHZ-900MHZ SMD

0

CP0402A1880FNTR

CP0402A1880FNTR

Elco (AVX)

DIRECTIONAL COUPLER

0

XC1900A-05S

XC1900A-05S

Anaren

RF DIR COUPLER 1.7GHZ-2GHZ SMD

0

LDC18836M20B-320

LDC18836M20B-320

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0603

0

CP0402A0897ENTR

CP0402A0897ENTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0805A0947BSTR

CP0805A0947BSTR

Elco (AVX)

DIRECTIONAL COUPLER

0

LDC21897M20H-056

LDC21897M20H-056

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

CP0402A0942ENTR

CP0402A0942ENTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0402A1960ANTR

CP0402A1960ANTR

Elco (AVX)

DIRECTIONAL COUPLER

0

XC1900A-10S

XC1900A-10S

Anaren

RF DIR COUPLER 1.7GHZ-2GHZ SMD

0

CP0402A0881ENTR

CP0402A0881ENTR

Elco (AVX)

DIRECTIONAL COUPLER

0

X4C30K1-20S

X4C30K1-20S

Anaren

RF DIRECTIONAL COUPLER 20DB

0

CP0603A0900BNTR

CP0603A0900BNTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0805B1907CSTR

CP0805B1907CSTR

Elco (AVX)

DIRECTIONAL COUPLER

0

LDC211G9517B-031

LDC211G9517B-031

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

CP0805A1441CWTR

CP0805A1441CWTR

Elco (AVX)

DIRECTIONAL COUPLER

0

RF Directional Coupler

1. Overview

Directional couplers are passive devices that sample a portion of RF/IF signal power for monitoring or feedback purposes. They enable signal splitting, reflection measurement, and signal-to-noise ratio optimization. These components are critical in wireless communication systems, RFID infrastructure, and industrial control applications.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microwave Ridge WaveguideHigh power handling (100W+), broadband operation5G Base stations, Satellite communication
Coaxial LineCompact design, 50/75 impedance optionsRFID readers, Test equipment
Microstrip PlanarLow profile, Surface-mount compatibleWLAN routers, IoT modules
Hybrid Coupler3dB power split with phase matchingMIMO systems, Beamforming networks

3. Structure and Components

Typical construction includes: - Precision-machined metal housing (aluminum/copper alloys) - Dielectric substrates (PTFE or ceramic materials) - Coupling slots/apertures (0.1-2.0mm dimensions) - Input/Output ports with SMA/N-Type connectors - Isolation termination resistor (50 matched load) - EMI shielding gaskets

4. Key Technical Specifications

ParameterTypical RangeImportance
Coupling Factor3-40 dBDetermines sampled power level
Directivity15-40 dBMeasures forward/reverse signal separation
Insertion Loss0.1-2.0 dBImpacts system power efficiency
VSWR1.1:1 - 1.5:1Affects impedance matching quality
Frequency Range30 MHz - 110 GHzDefines operational bandwidth

5. Application Fields

Key industries include: - Telecommunications (5G/4G BTS signal monitoring) - RFID systems (UHF/NFC reader sensitivity control) - Industrial IoT (Wireless sensor network optimization) - Medical equipment (MRI RF power management) - Automotive (V2X communication diagnostics)

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Analog DevicesADL552340GHz broadband, 20dB coupling accuracy
Mini-CircuitsZFDC-20-63-S+DC-20GHz, 3.5mm connectorized
TE ConnectivityRF-0424-01Automotive-grade RFID coupler
KRYTAR1010480010-48GHz, 50dB dynamic range

7. Selection Guidelines

Key considerations: - Frequency bandwidth match (1.5x operating range) - Power handling (1.2x maximum system power) - Directivity requirements (>30dB for precise measurements) - Environmental factors (operating temperature -40 C to +85 C) - Connector type compatibility (SMA vs N-Type) - Cost vs performance tradeoff (planar vs waveguide)

8. Industry Trends

Emerging developments: - Sub-6GHz massive MIMO integration - Advanced packaging for mmWave applications - AI-optimized coupling algorithms - Gallium Nitride (GaN) material adoption - Miniaturization for mobile device integration - Higher directivity (>50dB) research

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