RF Directional Coupler

Image Part Number Description / PDF Quantity Rfq
CP0805A1441ESTR

CP0805A1441ESTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0805B1890BSTR

CP0805B1890BSTR

Elco (AVX)

DIRECTIONAL COUPLER

0

HHS-109-PIN

HHS-109-PIN

Metelics (MACOM Technology Solutions)

HYBRID,BROAD-BAND,180_DEG,

25

CP0402A2400ENTR

CP0402A2400ENTR

Elco (AVX)

DIRECTIONAL COUPLER

0

LDC31847M10B-749

LDC31847M10B-749

TOKO / Murata

MULTI-LAY HYBRID COUPLER 1206

0

CX3042NLT

CX3042NLT

PulseLarsen Antenna

RF DIR COUPLER 5MHZ-1GHZ 6SMD

0

CP0603A3500GNTR

CP0603A3500GNTR

Elco (AVX)

DIRECTIONAL COUPLER

0

LDC211G9518H-073

LDC211G9518H-073

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

X3C07P1-05S

X3C07P1-05S

Anaren

RF DIR COUPLER 600MHZ-900MHZ SMD

0

LDC21815M20B-027

LDC21815M20B-027

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0805

0

CP0402A0851ANTR

CP0402A0851ANTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0603A0976CNTR

CP0603A0976CNTR

Elco (AVX)

DIRECTIONAL COUPLER

0

LDC181G8819B-327

LDC181G8819B-327

TOKO / Murata

MULTI-LAY HYBRID COUPLER 0603

0

CP0805L0436BSTR

CP0805L0436BSTR

Elco (AVX)

RF DIR COUPLER 436MHZ 0805

4400

CP0402A5500BNTR\500

CP0402A5500BNTR\500

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0402P0942ENTR

CP0402P0942ENTR

Elco (AVX)

DIRECTIONAL COUPLER

0

CP0805A0836ESTR

CP0805A0836ESTR

Elco (AVX)

DIRECTIONAL COUPLER

0

XEC24E3-03GR

XEC24E3-03GR

Anaren

RF DIR COUPLER 2.4-2.5GHZ 4SMD

0

CP0603A1643BNTR

CP0603A1643BNTR

Elco (AVX)

DIRECTIONAL COUPLER

0

1M710S

1M710S

Anaren

RF DIR COUPLER 3.3GHZ-3.7GHZ SMD

0

RF Directional Coupler

1. Overview

Directional couplers are passive devices that sample a portion of RF/IF signal power for monitoring or feedback purposes. They enable signal splitting, reflection measurement, and signal-to-noise ratio optimization. These components are critical in wireless communication systems, RFID infrastructure, and industrial control applications.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microwave Ridge WaveguideHigh power handling (100W+), broadband operation5G Base stations, Satellite communication
Coaxial LineCompact design, 50/75 impedance optionsRFID readers, Test equipment
Microstrip PlanarLow profile, Surface-mount compatibleWLAN routers, IoT modules
Hybrid Coupler3dB power split with phase matchingMIMO systems, Beamforming networks

3. Structure and Components

Typical construction includes: - Precision-machined metal housing (aluminum/copper alloys) - Dielectric substrates (PTFE or ceramic materials) - Coupling slots/apertures (0.1-2.0mm dimensions) - Input/Output ports with SMA/N-Type connectors - Isolation termination resistor (50 matched load) - EMI shielding gaskets

4. Key Technical Specifications

ParameterTypical RangeImportance
Coupling Factor3-40 dBDetermines sampled power level
Directivity15-40 dBMeasures forward/reverse signal separation
Insertion Loss0.1-2.0 dBImpacts system power efficiency
VSWR1.1:1 - 1.5:1Affects impedance matching quality
Frequency Range30 MHz - 110 GHzDefines operational bandwidth

5. Application Fields

Key industries include: - Telecommunications (5G/4G BTS signal monitoring) - RFID systems (UHF/NFC reader sensitivity control) - Industrial IoT (Wireless sensor network optimization) - Medical equipment (MRI RF power management) - Automotive (V2X communication diagnostics)

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Analog DevicesADL552340GHz broadband, 20dB coupling accuracy
Mini-CircuitsZFDC-20-63-S+DC-20GHz, 3.5mm connectorized
TE ConnectivityRF-0424-01Automotive-grade RFID coupler
KRYTAR1010480010-48GHz, 50dB dynamic range

7. Selection Guidelines

Key considerations: - Frequency bandwidth match (1.5x operating range) - Power handling (1.2x maximum system power) - Directivity requirements (>30dB for precise measurements) - Environmental factors (operating temperature -40 C to +85 C) - Connector type compatibility (SMA vs N-Type) - Cost vs performance tradeoff (planar vs waveguide)

8. Industry Trends

Emerging developments: - Sub-6GHz massive MIMO integration - Advanced packaging for mmWave applications - AI-optimized coupling algorithms - Gallium Nitride (GaN) material adoption - Miniaturization for mobile device integration - Higher directivity (>50dB) research

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