Resistors-Chassis Mount

Image Part Number Description / PDF Quantity Rfq
508AS102KDG2

508AS102KDG2

Ohmite

48W 8900J 1K OHM 10% SLAB

1

HCF110J470RJ

HCF110J470RJ

TE Connectivity AMP Connectors

HCF110 100W 470R 5% LEAD

20

UAL25-1R5F8

UAL25-1R5F8

Riedon

RES CHAS MNT 1.5 OHM 1% 25W

0

506SP750KG2

506SP750KG2

Ohmite

90W 800J 75 OHMS 10% SLAB

10

TE100B12RJ

TE100B12RJ

TE Connectivity AMP Connectors

RES CHAS MNT 12 OHM 5% 100W

10

RER55F1R24RC02

RER55F1R24RC02

Vishay / Dale

RES CHAS MNT 1.24 OHM 1% 30W

0

25WA250

25WA250

NTE Electronics, Inc.

RES CHAS MNT 5K OHM 10% 25W

28

RER55F2611RCSL

RER55F2611RCSL

Vishay / Dale

RES CHAS MNT 2.61K OHM 1% 30W

0

HSA5015KE

HSA5015KE

TE Connectivity AMP Connectors

RES CHAS MNT 15K OHM 3% 50W

815

L50J2K0

L50J2K0

Ohmite

RES CHAS MNT 2K OHM 5% 50W

0

RER55F30R1MCSL

RER55F30R1MCSL

Vishay / Dale

RES CHAS MNT 30.1 OHM 1% 30W

0

RER60F3R32RC02

RER60F3R32RC02

Vishay / Dale

RES CHAS MNT 3.32 OHM 1% 5W

10

HS250 15R F

HS250 15R F

Ohmite

RES CHAS MNT 15 OHM 1% 250W

0

HS250 68R F

HS250 68R F

Ohmite

RES CHAS MNT 68 OHM 1% 250W

0

TE500B47RJ

TE500B47RJ

TE Connectivity AMP Connectors

RES CHAS MNT 47 OHM 5% 500W

12

RER65FR845RCSL

RER65FR845RCSL

Vishay / Dale

RES CHAS MNT 0.845 OHM 1% 10W

0

HSA5075RJ

HSA5075RJ

TE Connectivity AMP Connectors

RES CHAS MNT 75 OHM 5% 50W

56

10WM150

10WM150

NTE Electronics, Inc.

RES CHAS MNT 500 OHM 1% 10W

105

5WM156

5WM156

NTE Electronics, Inc.

RES CHAS MNT 560 OHM 1% 5W

27

SHD1-100C075DE

SHD1-100C075DE

Ohmite

RES CHAS MNT 750 UOHM 0.5%

10

Resistors-Chassis Mount

1. Overview

Chassis Mount Resistors are specialized electronic components designed for direct mounting onto equipment chassis or heat sinks. They provide critical functions including current limiting, voltage division, and energy dissipation in high-power applications. Their importance in modern technology lies in enabling thermal management stability and electrical performance in industrial, automotive, and power electronics systems.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Wirewound Chassis MountHigh precision, pulse stability, 10-100W power ratingIndustrial motor drives, test equipment
Film Type Chassis MountLow noise, fast response, 5-50W ratingCommunication infrastructure, medical devices
Ceramic Composite MountHigh-temperature resistance, 50-300W ratingEV charging systems, renewable energy inverters

3. Structure and Composition

Typical construction includes:

  • Aluminum alloy heat-dissipating housing (surface-anodized for insulation)
  • High-purity ceramic substrate with resistive element (NiCr or TaN)
  • Multi-layer silicone coating for vibration resistance
  • Brass/copper alloy mounting terminals (anti-corrosion plated)

Thermal interface materials (TIM) ensure efficient heat transfer to chassis.

4. Key Technical Specifications

ParameterImportanceTypical Range
Rated PowerDetermines thermal handling capacity5-500W
Resistance RangeAffects current regulation precision0.1 -100k
ToleranceImpacts circuit accuracy 0.5% to 5%
Temperature CoefficientStability over operating temperature50-200ppm/ C
Dielectric StrengthSafety insulation performance1.5-5kV

5. Application Fields

Primary industries include:

  • Industrial automation (variable frequency drives, PLCs)
  • Renewable energy (solar inverters, wind turbine converters)
  • Transportation (EV on-board chargers, railway traction systems)
  • Telecommunications (base station power amplifiers, data center PSUs)

Case Study: 300W ceramic composite resistors in EV fast chargers enable 15-minute battery charging cycles.

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Vishay Precision GroupCPW-100100W wirewound, 0.1% tolerance
Ohmite Manufacturing270 series500W ceramic housing, IP65 rated
Panasonic ElectronicERJ-P11Thin-film technology, 100ppm/ C stability

7. Selection Guidelines

Key considerations:

  • Calculate required power derating (70% of max rating recommended)
  • Match resistance value with system voltage/current requirements
  • Evaluate thermal interface compatibility with chassis
  • Consider environmental factors (humidity, vibration, ambient temperature)
  • Budget allocation: High-reliability models may cost 2-3 standard versions

8. Industry Trends Analysis

Current development trends include:

  • Nano-ceramic materials enabling 40% smaller form factors
  • Integrated temperature sensing resistors for smart power systems
  • Graphene-enhanced thermal coatings improving heat dissipation by 25%
  • Automotive-grade models supporting 150 C operating temperatures
  • Industry 4.0 compatibility with IoT-enabled resistance monitoring

Market projections indicate 8.7% CAGR through 2030 driven by EV and 5G infrastructure demands.

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