Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-18V822JX Panasonic	RES ARRAY 4 RES 8.2K OHM 0502	0
EXB-2HV5R6JV Panasonic	RES ARRAY 8 RES 5.6 OHM 1506	0
EXB-18V330JX Panasonic	RES ARRAY 4 RES 33 OHM 0502	27287
EXB-38V751JV Panasonic	RES ARRAY 4 RES 750 OHM 1206	0
EXB-34V362JV Panasonic	RES ARRAY 2 RES 3.6K OHM 0606	0
EXB-V4V431JV Panasonic	RES ARRAY 2 RES 430 OHM 0606	0
EXB-38V360JV Panasonic	RES ARRAY 4 RES 36 OHM 1206	0
EXB-28V163JX Panasonic	RES ARRAY 4 RES 16K OHM 0804	5349
EXB-V4V244JV Panasonic	RES ARRAY 2 RES 240K OHM 0606	0
EXB-24V201JX Panasonic	RES ARRAY 2 RES 200 OHM 0404	0
EXB-38V471JV Panasonic	RES ARRAY 4 RES 470 OHM 1206	3214
EXB-V8V221JV Panasonic	RES ARRAY 4 RES 220 OHM 1206	15120
EXB-38V564JV Panasonic	RES ARRAY 4 RES 560K OHM 1206	9930
EXB-A10P122J Panasonic	RES ARRAY 8 RES 1.2K OHM 2512	0
EXB-V4V512JV Panasonic	RES ARRAY 2 RES 5.1K OHM 0606	0
EXB-34V750JV Panasonic	RES ARRAY 2 RES 75 OHM 0606	0
EXB-18V824JX Panasonic	RES ARRAY 4 RES 820K OHM 0502	0
EXB-N8V184JX Panasonic	RES ARRAY 4 RES 180K OHM 0804	0
EXB-N8V182JX Panasonic	RES ARRAY 4 RES 1.8K OHM 0804	19740
EXB-D10C560J Panasonic	RES ARRAY 8 RES 56 OHM 1206	5977

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages