Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-N8V2R0JX Panasonic	RES ARRAY 4 RES 2 OHM 0804	26578
EXB-V4V751JV Panasonic	RES ARRAY 2 RES 750 OHM 0606	0
EXB-14V181JX Panasonic	RES ARRAY 2 RES 180 OHM 0302	19930
EXB-V8V561JV Panasonic	RES ARRAY 4 RES 560 OHM 1206	23227
EXB-24V122JX Panasonic	RES ARRAY 2 RES 1.2K OHM 0404	19980
EXB-V4V180JV Panasonic	RES ARRAY 2 RES 18 OHM 0606	26110
EXB-38V8R2JV Panasonic	RES ARRAY 4 RES 8.2 OHM 1206	8199
EXB-E10C274J Panasonic	RES ARRAY 8 RES 270K OHM 1608	6090
EXB-D10C333J Panasonic	RES ARRAY 8 RES 33K OHM 1206	2792
EXB-V8VR000V Panasonic	RES ARRAY 4 RES ZERO OHM 1206	23458
EXB-38V514JV Panasonic	RES ARRAY 4 RES 510K OHM 1206	0
EXB-18V182JX Panasonic	RES ARRAY 4 RES 1.8K OHM 0502	5755
EXB-24V752JX Panasonic	RES ARRAY 2 RES 7.5K OHM 0404	0
EXB-V8V202JV Panasonic	RES ARRAY 4 RES 2K OHM 1206	0
EXB-34V240JV Panasonic	RES ARRAY 2 RES 24 OHM 0606	0
EXB-D10C682J Panasonic	RES ARRAY 8 RES 6.8K OHM 1206	6570
EXB-N8V161JX Panasonic	RES ARRAY 4 RES 160 OHM 0804	4211
EXB-N8V120JX Panasonic	RES ARRAY 4 RES 12 OHM 0804	8099
EXB-V8V824JV Panasonic	RES ARRAY 4 RES 820K OHM 1206	4980
EXB-28V150JX Panasonic	RES ARRAY 4 RES 15 OHM 0804	9126

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages