Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-28V123JX Panasonic	RES ARRAY 4 RES 12K OHM 0804	32868
EXB-V8V751JV Panasonic	RES ARRAY 4 RES 750 OHM 1206	0
EXB-18V221JX Panasonic	RES ARRAY 4 RES 220 OHM 0502	8037
EXB-24V1R5JX Panasonic	RES ARRAY 2 RES 1.5 OHM 0404	9837
EXB-24V221JX Panasonic	RES ARRAY 2 RES 220 OHM 0404	1879
EXB-28V564JX Panasonic	RES ARRAY 4 RES 560K OHM 0804	20000
EXB-18V104JX Panasonic	RES ARRAY 4 RES 100K OHM 0502	73395
EXB-A10P151J Panasonic	RES ARRAY 8 RES 150 OHM 2512	0
EXB-V4V204JV Panasonic	RES ARRAY 2 RES 200K OHM 0606	0
EXB-V8V511JV Panasonic	RES ARRAY 4 RES 510 OHM 1206	0
EXB-N8V224JX Panasonic	RES ARRAY 4 RES 220K OHM 0804	55219
EXB-D10C393J Panasonic	RES ARRAY 8 RES 39K OHM 1206	9634
EXB-18V180JX Panasonic	RES ARRAY 4 RES 18 OHM 0502	28930
EXB-14V474JX Panasonic	RES ARRAY 2 RES 470K OHM 0302	16920
EXB-28V114JX Panasonic	RES ARRAY 4 RES 110K OHM 0804	0
EXB-28V2R0JX Panasonic	RES ARRAY 4 RES 2 OHM 0804	17786
EXB-V4V160JV Panasonic	RES ARRAY 2 RES 16 OHM 0606	0
EXB-2HV2R2JV Panasonic	RES ARRAY 8 RES 2.2 OHM 1506	5000
EXB-V8V5R6JV Panasonic	RES ARRAY 4 RES 5.6 OHM 1206	7967
EXB-N8V683JX Panasonic	RES ARRAY 4 RES 68K OHM 0804	11155

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages