Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-24V111JX Panasonic	RES ARRAY 2 RES 110 OHM 0404	0
EXB-E10C820J Panasonic	RES ARRAY 8 RES 82 OHM 1608	0
EXB-D10C331J Panasonic	RES ARRAY 8 RES 330 OHM 1206	8225
EXB-V4V101JV Panasonic	RES ARRAY 2 RES 100 OHM 0606	47129
EXB-24V244JX Panasonic	RES ARRAY 2 RES 240K OHM 0404	0
EXB-18V121JX Panasonic	RES ARRAY 4 RES 120 OHM 0502	14538
EXB-28V1R1JX Panasonic	RES ARRAY 4 RES 1.1 OHM 0804	19900
EXB-14V561JX Panasonic	RES ARRAY 2 RES 560 OHM 0302	0
EXB-28V472JX Panasonic	RES ARRAY 4 RES 4.7K OHM 0804	102140
EXB-34V913JV Panasonic	RES ARRAY 2 RES 91K OHM 0606	0
EXB-N8V473JX Panasonic	RES ARRAY 4 RES 47K OHM 0804	41057
EXB-14V472JX Panasonic	RES ARRAY 2 RES 4.7K OHM 0302	31478
EXB-N8V122JX Panasonic	RES ARRAY 4 RES 1.2K OHM 0804	42011
EXB-2HV331JV Panasonic	RES ARRAY 8 RES 330 OHM 1506	73511
EXB-28V102JX Panasonic	RES ARRAY 4 RES 1K OHM 0804	125752
EXB-24V561JX Panasonic	RES ARRAY 2 RES 560 OHM 0404	15065
EXB-2HV821JV Panasonic	RES ARRAY 8 RES 820 OHM 1506	4165
EXB-F8E154G Panasonic	RES ARRAY 7 RES 150K OHM 8SIP	5314
EXB-24V682JX Panasonic	RES ARRAY 2 RES 6.8K OHM 0404	9490
EXB-N8V392JX Panasonic	RES ARRAY 4 RES 3.9K OHM 0804	485

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages