Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-V8V390JV Panasonic	RES ARRAY 4 RES 39 OHM 1206	9624
EXB-24V753JX Panasonic	RES ARRAY 2 RES 75K OHM 0404	0
EXB-V4V274JV Panasonic	RES ARRAY 2 RES 270K OHM 0606	23730
EXB-34V513JV Panasonic	RES ARRAY 2 RES 51K OHM 0606	0
EXB-28V362JX Panasonic	RES ARRAY 4 RES 3.6K OHM 0804	28696
EXB-A10P221J Panasonic	RES ARRAY 8 RES 220 OHM 2512	7417
EXB-24V914JX Panasonic	RES ARRAY 2 RES 910K OHM 0404	0
EXB-A10P474J Panasonic	RES ARRAY 8 RES 470K OHM 2512	0
EXB-V8V113JV Panasonic	RES ARRAY 4 RES 11K OHM 1206	0
EXB-28V302JX Panasonic	RES ARRAY 4 RES 3K OHM 0804	48657
EXB-V8V243JV Panasonic	RES ARRAY 4 RES 24K OHM 1206	0
EXB-14V270JX Panasonic	RES ARRAY 2 RES 27 OHM 0302	10000
EXB-N8V4R7JX Panasonic	RES ARRAY 4 RES 4.7 OHM 0804	3367
EXB-34V390JV Panasonic	RES ARRAY 2 RES 39 OHM 0606	43485
EXB-N8V560JX Panasonic	RES ARRAY 4 RES 56 OHM 0804	8100
EXB-28V510JX Panasonic	RES ARRAY 4 RES 51 OHM 0804	188117
EXB-D10C271J Panasonic	RES ARRAY 8 RES 270 OHM 1206	4324
EXB-2HV104JV Panasonic	RES ARRAY 8 RES 100K OHM 1506	61820
EXB-N8V270JX Panasonic	RES ARRAY 4 RES 27 OHM 0804	18479
EXB-24V681JX Panasonic	RES ARRAY 2 RES 680 OHM 0404	19490

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages