Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
SOMC1403330RGEA Vishay / Dale	RES ARRAY 7 RES 330 OHM 14SOIC	0
MSP10C01470RGEJ Vishay / Dale	RES ARRAY 9 RES 470 OHM 10SIP	0
MSP08A0118K0GEJ Vishay / Dale	RES ARRAY 7 RES 18K OHM 8SIP	0
CSC08A032K70GPA Vishay / Dale	RES ARRAY 4 RES 2.7K OHM 8SIP	0
SOMC1603120RGEA Vishay / Dale	RES ARRAY 8 RES 120 OHM 16SOIC	0
CSC05A01100KGPA Vishay / Dale	RES ARRAY 4 RES 100K OHM 5SIP	0
MSP09A0110K0GEJ Vishay / Dale	RES ARRAY 8 RES 10K OHM 9SIP	0
CRA06P08391K0JTA Vishay / Dale	RES ARRAY 4 RES 91K OHM 1206	0
MSP08C0147K0GEJ Vishay / Dale	RES ARRAY 7 RES 47K OHM 8SIP	0
CRA06S083470RJTA Vishay / Dale	RES ARRAY 4 RES 470 OHM 1206	85
SOMC1401100RGEA Vishay / Dale	RES ARRAY 13 RES 100 OHM 14SOIC	0
MDP1405121CGE04 Vishay / Dale	RES NTWRK 24 RES MULT OHM 14DIP	0
CSC06A034K70GPA Vishay / Dale	RES ARRAY 3 RES 4.7K OHM 6SIP	0
CSC10A0120K0GPA Vishay / Dale	RES ARRAY 9 RES 20K OHM 10SIP	0
CSC06A03100RGPA Vishay / Dale	RES ARRAY 3 RES 100 OHM 6SIP	0
CRA06P0832K00JTA Vishay / Dale	RES ARRAY 4 RES 2K OHM 1206	0
MDP1403390RGE04 Vishay / Dale	RES ARRAY 7 RES 390 OHM 14DIP	0
CSC10A011K20GEK Vishay / Dale	RES ARRAY 9 RES 1.2K OHM 10SIP	0
MSP08C011K50GEJ Vishay / Dale	RES ARRAY 7 RES 1.5K OHM 8SIP	0
CRA06S0835K10JTA Vishay / Dale	RES ARRAY 4 RES 5.1K OHM 1206	2485

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages