Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
SOMC16033K30JEA Vishay / Dale	RES ARRAY 8 RES 3.3K OHM 16SOIC	0
CSC08A03249RFEK Vishay / Dale	RES ARRAY 4 RES 249 OHM 8SIP	0
MSP10C015K60GEJ Vishay / Dale	RES ARRAY 9 RES 5.6K OHM 10SIP	0
MSP10A01120RGEJ Vishay / Dale	RES ARRAY 9 RES 120 OHM 10SIP	0
CRA06P08320R0JTA Vishay / Dale	RES ARRAY 4 RES 20 OHM 1206	0
SOMC160327K0GEA Vishay / Dale	RES ARRAY 8 RES 27K OHM 16SOIC	0
CSC04A015K10GPA Vishay / Dale	RES ARRAY 3 RES 5.1K OHM 4SIP	0
CSC10A01510RGPA Vishay / Dale	RES ARRAY 9 RES 510 OHM 10SIP	0
SOMC1603820RGEA Vishay / Dale	RES ARRAY 8 RES 820 OHM 16SOIC	0
SOMC1403110RGEA Vishay / Dale	RES ARRAY 7 RES 110 OHM 14SOIC	0
CSC06A03102KFPA Vishay / Dale	RES ARRAY 3 RES 102K OHM 6SIP	0
MSP08A0310K0GEJ Vishay / Dale	RES ARRAY 4 RES 10K OHM 8SIP	0
MSP10A05191AGEJ Vishay / Dale	RES NTWRK 16 RES MULT OHM 10SIP	0
SOMC140122K0GEA Vishay / Dale	RES ARRAY 13 RES 22K OHM 14SOIC	0
CSC10A031M00GPA Vishay / Dale	RES ARRAY 5 RES 1M OHM 10SIP	0
CSC08A03560RGEK Vishay / Dale	RES ARRAY 4 RES 560 OHM 8SIP	0
MDP140347R0GE04 Vishay / Dale	RES ARRAY 7 RES 47 OHM 14DIP	129
MSP08A031K00FEJ Vishay / Dale	RES ARRAY 4 RES 1K OHM 8SIP	0
CSC09A01680RGPA Vishay / Dale	RES ARRAY 8 RES 680 OHM 9SIP	0
SOMC1405580AGEA Vishay / Dale	RES NTWRK 24 RES MULT OHM 14SOIC	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages