Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
CRA12E08333R0JTR Vishay / Dale	RES ARRAY 4 RES 33 OHM 2012	5937
MDP1603220KGE04 Vishay / Dale	RES ARRAY 8 RES 220K OHM 16DIP	0
CSC06A034K70GEK Vishay / Dale	RES ARRAY 3 RES 4.7K OHM 6SIP	0
SOMC1403200RFEA Vishay / Dale	RES ARRAY 7 RES 200 OHM 14SOIC	0
CSC08A03470RGPA Vishay / Dale	RES ARRAY 4 RES 470 OHM 8SIP	0
MSP08C01470RGEJ Vishay / Dale	RES ARRAY 7 RES 470 OHM 8SIP	0
CRA06P08313R0JTA Vishay / Dale	RES ARRAY 4 RES 13 OHM 1206	0
CSC05A0110K0GPA Vishay / Dale	RES ARRAY 4 RES 10K OHM 5SIP	0
CSC10A013K90GEK Vishay / Dale	RES ARRAY 9 RES 3.9K OHM 10SIP	0
MSP08C033K30GEJ Vishay / Dale	RES ARRAY 4 RES 3.3K OHM 8SIP	20
MSP08C0368R0GEJ Vishay / Dale	RES ARRAY 4 RES 68 OHM 8SIP	0
CSC06A01220RGPA Vishay / Dale	RES ARRAY 5 RES 220 OHM 6SIP	0
MDP1403270RGE04 Vishay / Dale	RES ARRAY 7 RES 270 OHM 14DIP	0
SOMC16031K50GEA Vishay / Dale	RES ARRAY 8 RES 1.5K OHM 16SOIC	2172
CSC08A0333R0GPA Vishay / Dale	RES ARRAY 4 RES 33 OHM 8SIP	0
MSP10C0347K0GEJ Vishay / Dale	RES ARRAY 5 RES 47K OHM 10SIP	0
SOMC1401560RGEA Vishay / Dale	RES ARRAY 13 RES 560 OHM 14SOIC	0
MSP08A0333K0GEJ Vishay / Dale	RES ARRAY 4 RES 33K OHM 8SIP	0
MSP06A01470RGEJ Vishay / Dale	RES ARRAY 5 RES 470 OHM 6SIP	0
CSC08A014K70GPA Vishay / Dale	RES ARRAY 7 RES 4.7K OHM 8SIP	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages