Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
M8340105K1003GGD03 Vishay / Dale	RES ARRAY 4 RES 100K OHM 8SIP	0
CRA12E083470RJTR Vishay / Dale	RES ARRAY 4 RES 470 OHM 2012	0
MSP08A031K00GEJ Vishay / Dale	RES ARRAY 4 RES 1K OHM 8SIP	0
CRA06S083180KJTA Vishay / Dale	RES ARRAY 4 RES 180K OHM 1206	155
MSP08C03150RGEJ Vishay / Dale	RES ARRAY 4 RES 150 OHM 8SIP	0
CSC08A0310K0GEK Vishay / Dale	RES ARRAY 4 RES 10K OHM 8SIP	2395
MSP08A03680RGEJ Vishay / Dale	RES ARRAY 4 RES 680 OHM 8SIP	0
MSP09A011K00FEJ Vishay / Dale	RES ARRAY 8 RES 1K OHM 9SIP	0
MSP10C03100KGEJ Vishay / Dale	RES ARRAY 5 RES 100K OHM 10SIP	0
SOMC160127K0GEA Vishay / Dale	RES ARRAY 15 RES 27K OHM 16SOIC	0
CSC09A0110K0GEK Vishay / Dale	RES ARRAY 8 RES 10K OHM 9SIP	3094
MDP1403100KGE04 Vishay / Dale	RES ARRAY 7 RES 100K OHM 14DIP	0
CRASN20K0F10K0TA Vishay / Dale	RES ARRAY 2 RES MULT OHM 0606	424
CSC10A03220RGEK Vishay / Dale	RES ARRAY 5 RES 220 OHM 10SIP	893
CRA04S083240RJTD Vishay / Dale	RES ARRAY 4 RES 240 OHM 0804	14544
MDP140110K0GE04 Vishay / Dale	RES ARRAY 13 RES 10K OHM 14DIP	0
CSC06A0110K0GEK Vishay / Dale	RES ARRAY 5 RES 10K OHM 6SIP	503
SOMC160368R0GEA Vishay / Dale	RES ARRAY 8 RES 68 OHM 16SOIC	0
SOMC1603680RGEA Vishay / Dale	RES ARRAY 8 RES 680 OHM 16SOIC	0
CSC10A01180RGPA Vishay / Dale	RES ARRAY 9 RES 180 OHM 10SIP	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages