Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
CSC08A0347K0GEK Vishay / Dale	RES ARRAY 4 RES 47K OHM 8SIP	0
MSP06A016K80GEJ Vishay / Dale	RES ARRAY 5 RES 6.8K OHM 6SIP	0
MDP16033K90GE04 Vishay / Dale	RES ARRAY 8 RES 3.9K OHM 16DIP	0
MSP10A035K60GEJ Vishay / Dale	RES ARRAY 5 RES 5.6K OHM 10SIP	0
CRA06P08343K0JTA Vishay / Dale	RES ARRAY 4 RES 43K OHM 1206	0
MSP10A0110K0FEJ Vishay / Dale	RES ARRAY 9 RES 10K OHM 10SIP	0
SOMC20036K80GEA Vishay / Dale	RES ARRAY 10 RES 6.8K OHM 20SOIC	0
MSP06A011K00GEJ Vishay / Dale	RES ARRAY 5 RES 1K OHM 6SIP	0
SOMC14015K10GEA Vishay / Dale	RES ARRAY 13 RES 5.1K OHM 14SOIC	0
CSC08A03100KFPA Vishay / Dale	RES ARRAY 4 RES 100K OHM 8SIP	0
CRA06S04311R0JTA Vishay / Dale	RES ARRAY 2 RES 11 OHM 0606	0
CSC11B0110K0GPA Vishay / Dale	RES ARRAY 10 RES 10K OHM 11SIP	0
MSP10C05191AGEJ Vishay / Dale	RES NTWRK 16 RES MULT OHM 10SIP	0
CSC12B03100KGPA Vishay / Dale	RES ARRAY 6 RES 100K OHM 12SIP	0
CRASN100KF1K00TA Vishay / Dale	RES ARRAY 2 RES MULT OHM 0606	100
CRA06P0834K70FTA Vishay / Dale	RES ARRAY 4 RES 4.7K OHM 1206	6
CRA12E0832K20JTR Vishay / Dale	RES ARRAY 4 RES 2.2K OHM 2012	0
MSP06C01150RGEJ Vishay / Dale	RES ARRAY 5 RES 150 OHM 6SIP	0
CSC06A01100RGPA Vishay / Dale	RES ARRAY 5 RES 100 OHM 6SIP	0
MSP06C05131AGEJ Vishay / Dale	RES NETWORK 8 RES MULT OHM 6SIP	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages