Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
CSC08A031K50GEK Vishay / Dale	RES ARRAY 4 RES 1.5K OHM 8SIP	0
MSP10C01680RGEJ Vishay / Dale	RES ARRAY 9 RES 680 OHM 10SIP	12
CSC08B0310K0FEK Vishay / Dale	RES ARRAY 4 RES 10K OHM 8SIP	0
MDP1603510RJE04 Vishay / Dale	RES ARRAY 8 RES 510 OHM 16DIP	0
CSC04A011M00GPA Vishay / Dale	RES ARRAY 3 RES 1M OHM 4SIP	0
CSC06A01470RGPA Vishay / Dale	RES ARRAY 5 RES 470 OHM 6SIP	0
CRA12E08322K0JTR Vishay / Dale	RES ARRAY 4 RES 22K OHM 2012	0
MDP160310K0FE04 Vishay / Dale	RES ARRAY 8 RES 10K OHM 16DIP	0
SOMC14011M00GEA Vishay / Dale	RES ARRAY 13 RES 1M OHM 14SOIC	0
CSC09A01220RGPA Vishay / Dale	RES ARRAY 8 RES 220 OHM 9SIP	0
MDP1403150KGE04 Vishay / Dale	RES ARRAY 7 RES 150K OHM 14DIP	0
CRA06P0831K10JTA Vishay / Dale	RES ARRAY 4 RES 1.1K OHM 1206	0
SOMC160333R0GEA Vishay / Dale	RES ARRAY 8 RES 33 OHM 16SOIC	1330
CRA12E083330RJTR Vishay / Dale	RES ARRAY 4 RES 330 OHM 2012	0
M8340109K1003GCD03 Vishay / Dale	RES ARRAY 9 RES 100K OHM 10SIP	0
MDP1603150RGE04 Vishay / Dale	RES ARRAY 8 RES 150 OHM 16DIP	0
CSC08A03820RGPA Vishay / Dale	RES ARRAY 4 RES 820 OHM 8SIP	0
MDP1603180RGE04 Vishay / Dale	RES ARRAY 8 RES 180 OHM 16DIP	0
MSP08A0168K0FEJ Vishay / Dale	RES ARRAY 7 RES 68K OHM 8SIP	0
SOMC160333R0JEA Vishay / Dale	RES ARRAY 8 RES 33 OHM 16SOIC	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages