Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
M8340109K4701GCD03 Vishay / Dale	RES ARRAY 9 RES 4.7K OHM 10SIP	272
CSC10A032K20GPA Vishay / Dale	RES ARRAY 5 RES 2.2K OHM 10SIP	0
MDP14011K00GE04 Vishay / Dale	RES ARRAY 13 RES 1K OHM 14DIP	0
CSC06A0368K0GPA Vishay / Dale	RES ARRAY 3 RES 68K OHM 6SIP	0
CRA04S08322K0JTD Vishay / Dale	RES ARRAY 4 RES 22K OHM 0804	670
M8340105K2001FGD03 Vishay / Dale	RES ARRAY 4 RES 2K OHM 8SIP	0
CRA12E08320R0JTR Vishay / Dale	RES ARRAY 4 RES 20 OHM 2012	2000
MSP10C01330RGEJ Vishay / Dale	RES ARRAY 9 RES 330 OHM 10SIP	0
MSP08A0147K0FEJ Vishay / Dale	RES ARRAY 7 RES 47K OHM 8SIP	0
MSP06A0122K0GEJ Vishay / Dale	RES ARRAY 5 RES 22K OHM 6SIP	0
MSP10A0182K0GEJ Vishay / Dale	RES ARRAY 9 RES 82K OHM 10SIP	0
CSC08A01560RGPA Vishay / Dale	RES ARRAY 7 RES 560 OHM 8SIP	0
CSC09A011K00GEK Vishay / Dale	RES ARRAY 8 RES 1K OHM 9SIP	2047
CSC05A011M00GPA Vishay / Dale	RES ARRAY 4 RES 1M OHM 5SIP	0
CSC10A031K00GEK Vishay / Dale	RES ARRAY 5 RES 1K OHM 10SIP	0
MSP10C013K90GEJ Vishay / Dale	RES ARRAY 9 RES 3.9K OHM 10SIP	0
CRA06S08347K0JTC Vishay / Dale	RES ARRAY 4 RES 47K OHM 1206	17927
MDP160339R0GE04 Vishay / Dale	RES ARRAY 8 RES 39 OHM 16DIP	0
CRA06P0831K30JTA Vishay / Dale	RES ARRAY 4 RES 1.3K OHM 1206	0
CSC10B011K00GPA Vishay / Dale	RES ARRAY 9 RES 1K OHM 10SIP	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages