Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
MDP160368K0GE04 Vishay / Dale	RES ARRAY 8 RES 68K OHM 16DIP	0
CRA06P08362R0JTA Vishay / Dale	RES ARRAY 4 RES 62 OHM 1206	0
CSC04A0122K0GPA Vishay / Dale	RES ARRAY 3 RES 22K OHM 4SIP	0
CSC04A03150KGPA Vishay / Dale	RES ARRAY 2 RES 150K OHM 4SIP	0
SOMC1605191AGEA Vishay / Dale	RES NTWRK 28 RES MULT OHM 16SOIC	0
MSP06A01330RGEJ Vishay / Dale	RES ARRAY 5 RES 330 OHM 6SIP	0
CSC06A011K00GPA Vishay / Dale	RES ARRAY 5 RES 1K OHM 6SIP	0
MSP06A01150RGEJ Vishay / Dale	RES ARRAY 5 RES 150 OHM 6SIP	0
CRA06S083200RJTA Vishay / Dale	RES ARRAY 4 RES 200 OHM 1206	2584
SOMC160122K0GEA Vishay / Dale	RES ARRAY 15 RES 22K OHM 16SOIC	0
MSP10C0147R0GEJ Vishay / Dale	RES ARRAY 9 RES 47 OHM 10SIP	0
CRA04S08336R0JTD Vishay / Dale	RES ARRAY 4 RES 36 OHM 0804	990
MSP08A03270KGEJ Vishay / Dale	RES ARRAY 4 RES 270K OHM 8SIP	0
CSC10A031M00GEK Vishay / Dale	RES ARRAY 5 RES 1M OHM 10SIP	0
MDP16031K00FE04 Vishay / Dale	RES ARRAY 8 RES 1K OHM 16DIP	43
MDP16013K30GE04 Vishay / Dale	RES ARRAY 15 RES 3.3K OHM 16DIP	0
CSC10A032K20GEK Vishay / Dale	RES ARRAY 5 RES 2.2K OHM 10SIP	0
CSC08A01150RGPA Vishay / Dale	RES ARRAY 7 RES 150 OHM 8SIP	0
MSP10A0112K0FEJ Vishay / Dale	RES ARRAY 9 RES 12K OHM 10SIP	0
CRA06S0832K40JTA Vishay / Dale	RES ARRAY 4 RES 2.4K OHM 1206	8

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages