Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
CSC09A013K30GPA Vishay / Dale	RES ARRAY 8 RES 3.3K OHM 9SIP	0
SOMC1603100RGEA Vishay / Dale	RES ARRAY 8 RES 100 OHM 16SOIC	0
CRA06P083620KJTA Vishay / Dale	RES ARRAY 4 RES 620K OHM 1206	0
CRA04P08315K0JTD Vishay / Dale	RES ARRAY 4 RES 15K OHM 0804	6711
CSC05A01680RGPA Vishay / Dale	RES ARRAY 4 RES 680 OHM 5SIP	0
CSC10A03270KGPA Vishay / Dale	RES ARRAY 5 RES 270K OHM 10SIP	0
CSC10A015K60GPA Vishay / Dale	RES ARRAY 9 RES 5.6K OHM 10SIP	0
MDP14015K10GE04 Vishay / Dale	RES ARRAY 13 RES 5.1K OHM 14DIP	0
CSC08A011K00GPA Vishay / Dale	RES ARRAY 7 RES 1K OHM 8SIP	0
CSC10A03150RGEK Vishay / Dale	RES ARRAY 5 RES 150 OHM 10SIP	0
CRA06P083430RJTA Vishay / Dale	RES ARRAY 4 RES 430 OHM 1206	0
CSC10A05102AGPA Vishay / Dale	RES NTWRK 16 RES MULT OHM 10SIP	0
CSC09A014K70GPA Vishay / Dale	RES ARRAY 8 RES 4.7K OHM 9SIP	0
CSC10A032K70GPA Vishay / Dale	RES ARRAY 5 RES 2.7K OHM 10SIP	0
MDP16036K80GE04 Vishay / Dale	RES ARRAY 8 RES 6.8K OHM 16DIP	0
CSC06A03100KGEK Vishay / Dale	RES ARRAY 3 RES 100K OHM 6SIP	0
M8340102K1002GBD04 Vishay / Dale	RES ARRAY 15 RES 10K OHM 16DIP	79
CRA04S08362R0JTD Vishay / Dale	RES ARRAY 4 RES 62 OHM 0804	18
CSC10A01100KGEK Vishay / Dale	RES ARRAY 9 RES 100K OHM 10SIP	3046
CRA06S0831M00JTA Vishay / Dale	RES ARRAY 4 RES 1M OHM 1206	3700

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages