Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
CRA06P0834K30JTA Vishay / Dale	RES ARRAY 4 RES 4.3K OHM 1206	0
CSC10A01330RGEK Vishay / Dale	RES ARRAY 9 RES 330 OHM 10SIP	0
SOMC1603100RJEA Vishay / Dale	RES ARRAY 8 RES 100 OHM 16SOIC	7343
CSC08A03120RGPA Vishay / Dale	RES ARRAY 4 RES 120 OHM 8SIP	0
MDP1405191AGE04 Vishay / Dale	RES NTWRK 24 RES MULT OHM 14DIP	0
MDP140330R0GE04 Vishay / Dale	RES ARRAY 7 RES 30 OHM 14DIP	0
MSP10C014K70GEJ Vishay / Dale	RES ARRAY 9 RES 4.7K OHM 10SIP	0
MSP06A05131AGEJ Vishay / Dale	RES NETWORK 8 RES MULT OHM 6SIP	0
CRA06S083200KJTA Vishay / Dale	RES ARRAY 4 RES 200K OHM 1206	96
CSC10A01510RGEK Vishay / Dale	RES ARRAY 9 RES 510 OHM 10SIP	0
MSP08C03390RGEJ Vishay / Dale	RES ARRAY 4 RES 390 OHM 8SIP	0
CSC08A014K70GEK Vishay / Dale	RES ARRAY 7 RES 4.7K OHM 8SIP	593
CSC07A0147K0GPA Vishay / Dale	RES ARRAY 6 RES 47K OHM 7SIP	0
CSC09A0147K0GEK Vishay / Dale	RES ARRAY 8 RES 47K OHM 9SIP	894
CSC04A016K80GPA Vishay / Dale	RES ARRAY 3 RES 6.8K OHM 4SIP	0
MSP10A0356R0GEJ Vishay / Dale	RES ARRAY 5 RES 56 OHM 10SIP	0
MSP10A011K00GEJ Vishay / Dale	RES ARRAY 9 RES 1K OHM 10SIP	0
CSC09B014K70GPA Vishay / Dale	RES ARRAY 8 RES 4.7K OHM 9SIP	0
M8340106K1002GCD03 Vishay / Dale	RES ARRAY 9 RES 10K OHM 10SIP	113
CRA06S08343R0JTA Vishay / Dale	RES ARRAY 4 RES 43 OHM 1206	3300

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages